See how MEMS brings ultrasonic sensing into the semiconductor era: smaller, SMD-ready and scalable for robotics, smart buildings, smart devices and industrial automation.

Overview

For decades, ultrasonic sensing has served industrial automation, building management, automotive and consumer products, mostly with piezoelectric transducers. New applications now ask for more: smaller form factors, tighter integration and volume production on semiconductor processes.

In this on-demand webinar, Dr. Stefan Mastel shows how MEMS technology meets those requirements without changing the physics of ultrasound. He covers pulse-echo and time-of-flight basics, compares MEMS with conventional piezo transducers, and introduces Infineon's XENSIV™ MEMS ultrasonic transceivers. They are built on the Sealed Dual Membrane (SDM) architecture and come in analog and digital versions.

The second half covers applications: privacy-preserving occupancy sensing in smart buildings, and close-range awareness for robots and industrial automation. It then looks ahead to ultrasonic arrays, beamforming, sensor fusion and AI-assisted signal processing. The session closes with the evaluation kit and engineering samples available today.

What you'll learn

  • Why ultrasound still wins where cameras, LiDAR and radar struggle: darkness, dust and fog, transparent objects, privacy, and direct distance data with low processing load
  • How pulse-echo sensing works: time of flight, the ringing phase and the target echo
  • Where MEMS differs from piezo: footprint, semiconductor scalability, device-to-device consistency, and SMD assembly with reflow soldering
  • How the Sealed Dual Membrane (SDM) architecture and the MEMS, ASIC, package and sound port work together
  • When to choose the analog or the digital transceiver, and how a uniform 180° transmit pattern lets you shape the sound channel for your application
  • Where MEMS ultrasound fits today and next: occupancy sensing, robotics, industrial automation, touchless HMI and multi-sensor arrays

Key takeaways

  • Ultrasound remains a trusted sensing technology. It works in darkness and harsh environments, detects transparent objects, preserves privacy and delivers direct distance data with simple processing.
  • MEMS brings ultrasound into the semiconductor era. The physics stays the same. What changes is how sensors are manufactured, integrated and scaled: smaller footprint, tight process consistency, pick-and-place assembly and reflow soldering.
  • MEMS ultrasound opens new use cases. Opportunities include occupancy sensing, robotics, smart appliances and industrial automation. Arrays of transceivers add spatial sensing, beamforming and AI-assisted signal processing.
Documents

Speaker

Dr. Stefan Mastel
Dr. Stefan Mastel

Manager Emerging Acoustics, Infineon Technologies

Stefan Mastel leads business development for emerging acoustics applications at Infineon in Munich. Before taking this role in October 2025, he was Manager Business Development & Innovation in Infineon's MEMS Venture. He previously worked as a sales application engineer at attocube/neaspec and holds a PhD in physics from CIC nanoGUNE, where he specialised in nano-optics.

Beyond Piezo: MEMS Ultrasonic Transceivers
Get instant access to the recording. Engineering samples and the evaluation kit are available on request.
Online | Webinars | On-demand