FF1800R17IP5P 1700 V, 1800 A dual IGBT module

Overview

PrimePACK™ 3+ 1700 V, 1800 A dual IGBT module with TRENCHSTOP™ IGBT5 and .XT interconnection technology,  Emitter Controlled 5 diode and NTC and pre-applied Thermal Interface Material.

Summary of Features

  • Extended operation temperature (Tvjop= 175°C)
  • Output current increased by more than 25% in the same footprint
  • Copper bonds for high current carrying capabilities
  • Sintering of chips for highest power cycling capabilities
  • Total losses reduced by up to 20%
  • Package with CTI > 400

Benefits

  • Increase in power density by up to 25%
  • Up to 10 times longer lifetime
  • Less cooling effort for same output power
  • Enables higher system overload conditions
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