Infineon at PCIM 2020

Dear valued customer,

Due to the increasing spread of Covid-19 in Europe and the associated ban on all major German events up to, and including the end of August, the PCIM Europe exhibition and conference 2020 in Nuremberg has been cancelled.

The event had already been postponed from May to 28 – 30 July 2020, and will now take place again next year.

The full Mesago statement can be found here.



Infineon will run PCIM 2020 completely virtually this year. You will get comprehensive insights into our product innovations and solution highlights at our virtual booth.

Stay tuned and “Experience the difference in power” soon. We are looking forward to welcoming you to our virtual booth!

Experience the difference in power - Go live 1 July 2020!

With the broadest power device portfolio in the industry – spanning silicon, silicon carbide (CoolSiC™) and gallium nitride (CoolGaN™) technologies – Infineon continues to set the pace for power solutions that support innovative design and meet the expectations and demands of modern designers.

On July 1, we will go live – unleashing the full power of our PCIM virtual booth with all its happening technologies, expert insights and demo details.

Visit out Virtual booth

Conference & Forum: 7-8 July 2020


This year PCIM 2020 Conference & Forum will be held completely virtually by Mesago.

Join the “PCIM Europe digital days” on 7-8 July to listen to our Infineon experts on the topics listed below.

Oral sessions

Topic: Author:

Si and GaN Integration:
Optimization of Monolithic RC Snubber in a 100V Shielded-Gate MOSFET

Hrach Amirkhanian,
Infineon Technologies America

Ruggedness and Reliability:
Enhanced Lifetime and Power Cycling Modeling for PrimePACK™ .XT Power Modules

Torsten Methfessel,
Infineon Technologies

Gate Drivers and Protection:
Driving GaN HEMT High-Voltage Half-Bridge with a Single-Channel Low-Side Gate Driver with Truly Differential Inputs

Diogo Varajao,
Infineon Technologies

High Voltage IGBT Modules:
XHP™ 2 – The Low Inductive, Multi-Package Housing for the Next Generation of High-Power Applications

Waleri Brekel,
Infineon Technologies

High Voltage IGBT Modules:
Latest IGBT4 Chip Technology Enables the First 2000 A 3300 V Module in IHV Package

Vishal Jadhav,
Infineon Technologies

High Voltage IGBT Modules:
2.3 kV – A New Voltage Class for Si-IGBT and Si-FWD

Frank Umbach,
Infineon Technologies

Design Tools and Applications II:
Advanced Physics-Based Compact Models for New IGBT Technologies

Arnab Biswas,
Infineon Technologies

Design Tools and Applications II:
Behavioral Compact Models for IGBTs and Si-Diodes for Extended Datasheet Simulations

Daniel Ludwig,
Infineon Technologies

E-Mobility Forum

Topics: Presenter:

E-Mobility Ecosystem to Keep Goods and People Moving 
Key Components for Charger, Drive-Train and Auxiliaries

Dr. Martin Schulz,
Infineon Technologies

Industry Forum

Topic: Speaker

SiC Goes Broad in Industrial Power Electronics with Features Meeting Expectations of Modern Designers
Wednesday, 8 July 2020, 10:00 am - 10:15 am

Dr. Peter Friedrichs,
Infineon Technologies

Gate Driving Solutions for GaN HEMT Switches Enabling Robust and High Power Density Designs
Wednesday, 8 July 2020, 01:30 pm - 01:45 pm

Dr. Diogo Varajao,
Infineon Technologies