The ever-increasing power demand driven by AI workloads is accelerating the evolution of power supply units (PSUs) designs in terms of system efficiency and power density to meet form factor limitations while maintaining strict hold-up time requirements.

The combination of Infineon’s application and system expertise, together with input from data center operators and power supply manufacturers, has resulted in a complete roadmap of reference boards, including both one- and three-phase designs, ranging between 3 and 30 kW.

Infineon unique value proposition:

Do you want to dive deeper into Infineon’s product portfolio for AI SMPS? Check out our interactive block diagram here or watch our latest webinar on-demand.

  • Complete power supply targeting the Open Compute V3 rectifier specifications
  • 97.5 % peak efficiency
  • Bridgeless totem-pole PFC with CoolSiC™
  • Half-bridge LLC with CoolMOS™ and OptiMOS™
  • Full digital control with XMCTM microcontroller
  • Open Compute V3 rectifier (PSU) form factor (overall dimensions)
  • 20 ms hold-up time at full load
  • EMC class B pre-compliance tested
  • Available as evaluation board
  • Benchmark 97.5% efficiency @ 95 W/in³ including all/1U form factor
  • CoolSiC™, CoolGaN™, CoolMOS™,  OptiMOS™ and technologies for highest efficiency and power density
  • Novel integrated planar magnetic construction
  • Full digital control (PFC and DC-DC)
  • Totem-pole PFC + half-bridge GaN LLC
  • Complete power supply unit (PSU) including PFC + DC-DC
  • Hold-up time extension circuit
  • Available as reference board
  • 97.6% Peak efficiency @ 98 W/in³
  • 3-level flying capacitor PFC
  • High frequency GaN LLC (500 kHz)
  • Fully integrated transformer structure
  • System solution using GaN, SiC and Si
  • OCP efficiency spec incl high p. density
  • Flying cap. charge solution at start-up
  • S3-level driving supply
  • Hold-up time extension circuit
  • 98% Efficiency @ 95 W/in³
  • OptiMOS™ High Efficiency
  • Planar magnetic design
  • Full digital control
  • Totem-Pole PFC GaN
  • Half-Bridge LLC converter
  • Complete Infineon solution
  • Full PSU including PFC
  • Very high efficiency
  • Extended Hold Up Time
  • 98.95% efficiency @ 50% load
  • 98.48% efficiency @ 100% load
  • 200 kHz resonant frequency
  • Three-phase interleaved LLC
  • High-performance CoolSiC™ 650 V in TOLT
  • Top-side cooling
  • Ultra high efficiency and power density
  • Digital control
  • Full digital control Interleaved Bridgeless totem-pole PFC + Full-Bridge GaN LLC
  • Benchmark 97.5 % of efficiency (optimized design to reduced cooling effort – reduction of air conditioning)
  • High power density 100 W/in³ (twice as much than the ORv3 specification)
  • Highest frequency in high-voltage LLC thanks to GaN transistors
  • Complete Power Supply Unit (PSU) including single-phase PFC + DCDC
  • Great system performance by enabled by hybrid switch approach – Si, SiC and GaN
  • Highest efficiency and power density
  • Following ORv3 form factor for server
  • Lower number of capacitors, to reduce volume, for higher reliability and condensed system size.
  • Available as reference board
  • Full digital control interleaved bridgeless totem-pole PFC + Full-Bridge GaN LLC
  • Benchmark higher than 97.5 % of peak efficiency (optimized design to reduce cooling effort – reduction of air conditioning)
  • 96.5% eff. at 230 VAC and 100% output load
  • 40 x 68 x 640 mm including chassis
  • High power density 113 W/in3
  • Complete Power Supply Unit (PSU) including single-phase PFC + DCDC
  • Great system performance enabled by hybrid switch approach – Si, SiC and GaN
  • Highest efficiency and power density
  • Following 19-inch rack form factor for server
  • Lower number of capacitors, to reduce volume, for higher reliability and condensed system size, deploying an energy buffer circuit.
  • Available as reference board
  • 5level Totem-Pole PFC + HB-Bridge LLC
  • Benchmark higher than 97.5 % of peak efficiency
  • High power density 100 W/in³
  • Energy buffer to address EDPP requirements
  • Hold up time extension circuit for 20ms @100% Load 350 kHz LLC switching frequency
  • 40 x 104 x 710 mm so fitting to 19" rack to lower total cost (traditionally 21" racks used)
  • Meet AI load transients from GPU companies
  • Highest efficiency and power density
  • Novel integrated planar magnetic construction (modular scalable transformer)
  • High efficiency to meet thermal requirements
  • Full digital control (PFC and DCDC)
  • Available as reference board
  • Interleaved T-Type Vienna 3-Φ PFC topology
  • 99% peak efficiency and 98.9% full load efficiency
  • 40 x 342 x 133 mm
  • High power density ~270 W/in³
  • Highlight products: CoolGaN™ BDS and PSOC™ Control C3 P8
  • Highest efficiency and power density based on interleaved T-Type PFC
  • One GaN BDS replaces 4x 650 V SiC switches improving power-density and cost
  • Full-digital control with Infineon PSOC™ C3 P8 controller
  • Performance: PF > 0.98, 20% at 80% load
  • Complete power supply targeting the Open Compute V3 rectifier specifications
  • 97.5 % peak efficiency
  • Bridgeless totem-pole PFC with CoolSiC™
  • Half-bridge LLC with CoolMOS™ and OptiMOS™
  • Full digital control with XMCTM microcontroller
  • Open Compute V3 rectifier (PSU) form factor (overall dimensions)
  • 20 ms hold-up time at full load
  • EMC class B pre-compliance tested
  • Available as evaluation board
  • Benchmark 97.5% efficiency @ 95 W/in³ including all/1U form factor
  • CoolSiC™, CoolGaN™, CoolMOS™,  OptiMOS™ and technologies for highest efficiency and power density
  • Novel integrated planar magnetic construction
  • Full digital control (PFC and DC-DC)
  • Totem-pole PFC + half-bridge GaN LLC
  • Complete power supply unit (PSU) including PFC + DC-DC
  • Hold-up time extension circuit
  • Available as reference board
  • 97.6% Peak efficiency @ 98 W/in³
  • 3-level flying capacitor PFC
  • High frequency GaN LLC (500 kHz)
  • Fully integrated transformer structure
  • System solution using GaN, SiC and Si
  • OCP efficiency spec incl high p. density
  • Flying cap. charge solution at start-up
  • S3-level driving supply
  • Hold-up time extension circuit
  • 98% Efficiency @ 95 W/in³
  • OptiMOS™ High Efficiency
  • Planar magnetic design
  • Full digital control
  • Totem-Pole PFC GaN
  • Half-Bridge LLC converter
  • Complete Infineon solution
  • Full PSU including PFC
  • Very high efficiency
  • Extended Hold Up Time
  • 98.95% efficiency @ 50% load
  • 98.48% efficiency @ 100% load
  • 200 kHz resonant frequency
  • Three-phase interleaved LLC
  • High-performance CoolSiC™ 650 V in TOLT
  • Top-side cooling
  • Ultra high efficiency and power density
  • Digital control
  • Full digital control Interleaved Bridgeless totem-pole PFC + Full-Bridge GaN LLC
  • Benchmark 97.5 % of efficiency (optimized design to reduced cooling effort – reduction of air conditioning)
  • High power density 100 W/in³ (twice as much than the ORv3 specification)
  • Highest frequency in high-voltage LLC thanks to GaN transistors
  • Complete Power Supply Unit (PSU) including single-phase PFC + DCDC
  • Great system performance by enabled by hybrid switch approach – Si, SiC and GaN
  • Highest efficiency and power density
  • Following ORv3 form factor for server
  • Lower number of capacitors, to reduce volume, for higher reliability and condensed system size.
  • Available as reference board
  • Full digital control interleaved bridgeless totem-pole PFC + Full-Bridge GaN LLC
  • Benchmark higher than 97.5 % of peak efficiency (optimized design to reduce cooling effort – reduction of air conditioning)
  • 96.5% eff. at 230 VAC and 100% output load
  • 40 x 68 x 640 mm including chassis
  • High power density 113 W/in3
  • Complete Power Supply Unit (PSU) including single-phase PFC + DCDC
  • Great system performance enabled by hybrid switch approach – Si, SiC and GaN
  • Highest efficiency and power density
  • Following 19-inch rack form factor for server
  • Lower number of capacitors, to reduce volume, for higher reliability and condensed system size, deploying an energy buffer circuit.
  • Available as reference board
  • 5level Totem-Pole PFC + HB-Bridge LLC
  • Benchmark higher than 97.5 % of peak efficiency
  • High power density 100 W/in³
  • Energy buffer to address EDPP requirements
  • Hold up time extension circuit for 20ms @100% Load 350 kHz LLC switching frequency
  • 40 x 104 x 710 mm so fitting to 19" rack to lower total cost (traditionally 21" racks used)
  • Meet AI load transients from GPU companies
  • Highest efficiency and power density
  • Novel integrated planar magnetic construction (modular scalable transformer)
  • High efficiency to meet thermal requirements
  • Full digital control (PFC and DCDC)
  • Available as reference board
  • Interleaved T-Type Vienna 3-Φ PFC topology
  • 99% peak efficiency and 98.9% full load efficiency
  • 40 x 342 x 133 mm
  • High power density ~270 W/in³
  • Highlight products: CoolGaN™ BDS and PSOC™ Control C3 P8
  • Highest efficiency and power density based on interleaved T-Type PFC
  • One GaN BDS replaces 4x 650 V SiC switches improving power-density and cost
  • Full-digital control with Infineon PSOC™ C3 P8 controller
  • Performance: PF > 0.98, 20% at 80% load