The ever-increasing power demand driven by AI data centers is forcing an expedited evolution of power supply units (PSUs) designs, growing from 800 W to an astounding 8 kW, with projections extending beyond 12 kW and heading to 3-phases designs.  Moreover, the system efficiency requirements have risen to more than 97.5 %, coincident with increasing higher power densities (e.g., 100 W/in³) to meet form factor limitations while maintaining strict hold-up time requirements.

The combination of Infineon’s application and system expertise with input from data center operators and power supply manufacturers has resulted in developing a family of reference boards from 3 kW to 12 kW. These solutions demonstrate the capabilities and proof points of how the industry’s PSU performance requirements can be achieved with Infineon’s power semiconductor technologies.

As a leader in power semiconductors with high-performing silicon carbide MOSFET - CoolSiC™, gallium nitride transistors - CoolGaN™, and silicon MOSFET - CoolMOS™, these PSUs leverage the benefits of each of Infineon’s technologies to maximize performance from AC to DC, to exceed the requirement of efficiency and power density, which brings the value of sustainability of high reliability for AI servers and data center systems.

AI-PSU boards evolution
AI-PSU boards evolution
AI-PSU boards evolution
  • Complete power supply targeting the Open Compute V3 rectifier specifications
  • 97.5 % peak efficiency
  • Bridgeless totem-pole PFC with CoolSiC™
  • Half-bridge LLC with CoolMOS™ and OptiMOS™
  • Full digital control with XMCTM microcontroller
  • Open Compute V3 rectifier (PSU) form factor (overall dimensions)
  • 20 ms hold-up time at full load
  • EMC class B pre-compliance tested
  • Available as evaluation board
  • CoolSiC™ MOSFET 650 V
  • 600 V CoolMOS™ SJ MOSFET C7
  • 600 V CoolMOS™ SJ MOSFET CFD7
  • OptiMOS™ 5 Power MOSFET 80 V
  • EiceDRIVER™ single-channel & dual-channel driver
  • CoolSET™ Flyback controller with integrated 800 V CoolMOS™
  • XMC™ industrial microcontroller
  • DC-DC step-down voltage regulator
  • Medium-power Schottky diode
document

Evaluation board EVAL_3KW_50V_PSU

Download now
  • Benchmark 97.5% efficiency @ 95 W/in³ including all/1U form factor
  • CoolSiC™, CoolGaN™, CoolMOS™,  OptiMOS™ and technologies for highest efficiency and power density
  • Novel integrated planar magnetic construction
  • Full digital control (PFC and DC-DC)
  • Totem-pole PFC + half-bridge GaN LLC
  • Complete power supply unit (PSU) including PFC + DC-DC
  • Hold-up time extension circuit
  • Available as reference board
  • CoolSiC™ MOSFETs 650 V
  • CoolGaN™ Transistor 650 V
  • 600 V CoolMOS™ 8 SJ MOSFET
  • CoolSiC™ Schottky diode G5 650 V
  • EiceDRIVER™ 1EDB, 1EDN, 2EDB
  • OptiMOS™ 5 MOSFET 80 V
  • CoolSET™  Flyback controller with integrated 800 V CoolMOS™
  • ISOFACE™ digital isolator
  • XMC™ industrial microcontroller
  • Full digital control Interleaved Bridgeless totem-pole PFC + Full-Bridge GaN LLC
  • Benchmark 97.5 % of efficiency (optimized design to reduced cooling effort – reduction of air conditioning)
  • High power density 100 W/in³ (twice as much than the ORv3 specification)
  • Highest frequency in high-voltage LLC thanks to GaN transistors
  • Complete Power Supply Unit (PSU) including single-phase PFC + DCDC
  • Great system performance by enabled by hybrid switch approach – Si, SiC and GaN
  • Highest efficiency and power density
  • Following ORv3 form factor for server
  • Lower number of capacitors, to reduce volume, for higher reliability and condensed system size.
  • Available as reference board
  • CoolSiC™ MOSFET 650 V
  • CoolGaN™ Transistors 650 V
  • 600 V CoolMOS™ 8 SJ MOSFET
  • OptiMOS™ 5 Power MOSFET 80 V
  • OptiMOS™ 5 Power MOSFET 60 V
  • EiceDRIVER™ 1EDB, 1EDN, 2EDB
  • CoolSET™ flyback controller with integrated 800 V CoolMOS™
  • OPTIREG™ switches
  • ISOFACE™ digital isolator 
REF_8KW_HFHD_PSU: 8 kW power supply unit
Explore Infineon's REF_8KW_HFHD_PSU, a compact, 8 kW power supply design delivering 97.5% peak efficiency and 100 W/in³ power density. Built for AI and data center applications, it features advanced CoolMOS™, CoolSiC™, CoolGaN™, and OptiMOS™ technologies, along with a 500 kHz LLC switching frequency and 20 ms hold-up time. Discover how it supports next-gen infrastructure needs with unrivaled performance.
document

8 kW high power density and high frequency PSU for AI data centers and servers

Download now
  • Benchmark 97.5% efficiency @100 W/in³ including all/1U form factor
  • CoolSiC™, CoolGaN™, CoolMOS™,  OptiMOS™ technologies for highest efficiency and power density
  • Modular approach (2x 6 kW modules)
  • Multi-level topology
  • Novel, holistic control scheme
  • Full digital control
  • Complete power supply unit (PSU) including PFC + DC-DC
  • High efficiency, high power density
  • Modular design for superior light-load efficiency and ease of manufacturing
  • CoolSiC™ MOSFET 400 V
  • CoolGaN™ Transistor 100 V
  • 600 V CoolMOS™ 8 SJ MOSFET 
  • CoolSiC™ Schottky diode G5 650 V
  • EiceDRIVER™ 1EDB, 1EDN, 2EDB
  • CoolSET™ flyback controller with integrated 800 V CoolMOS™
  • ISOFACE™ digital isolator 
  • PSoC ™ and XMC™ microcontroller

  • Complete power supply targeting the Open Compute V3 rectifier specifications
  • 97.5 % peak efficiency
  • Bridgeless totem-pole PFC with CoolSiC™
  • Half-bridge LLC with CoolMOS™ and OptiMOS™
  • Full digital control with XMCTM microcontroller
  • Open Compute V3 rectifier (PSU) form factor (overall dimensions)
  • 20 ms hold-up time at full load
  • EMC class B pre-compliance tested
  • Available as evaluation board
  • CoolSiC™ MOSFET 650 V
  • 600 V CoolMOS™ SJ MOSFET C7
  • 600 V CoolMOS™ SJ MOSFET CFD7
  • OptiMOS™ 5 Power MOSFET 80 V
  • EiceDRIVER™ single-channel & dual-channel driver
  • CoolSET™ Flyback controller with integrated 800 V CoolMOS™
  • XMC™ industrial microcontroller
  • DC-DC step-down voltage regulator
  • Medium-power Schottky diode
document

Evaluation board EVAL_3KW_50V_PSU

Download now

  • Benchmark 97.5% efficiency @ 95 W/in³ including all/1U form factor
  • CoolSiC™, CoolGaN™, CoolMOS™,  OptiMOS™ and technologies for highest efficiency and power density
  • Novel integrated planar magnetic construction
  • Full digital control (PFC and DC-DC)
  • Totem-pole PFC + half-bridge GaN LLC
  • Complete power supply unit (PSU) including PFC + DC-DC
  • Hold-up time extension circuit
  • Available as reference board
  • CoolSiC™ MOSFETs 650 V
  • CoolGaN™ Transistor 650 V
  • 600 V CoolMOS™ 8 SJ MOSFET
  • CoolSiC™ Schottky diode G5 650 V
  • EiceDRIVER™ 1EDB, 1EDN, 2EDB
  • OptiMOS™ 5 MOSFET 80 V
  • CoolSET™  Flyback controller with integrated 800 V CoolMOS™
  • ISOFACE™ digital isolator
  • XMC™ industrial microcontroller

  • Full digital control Interleaved Bridgeless totem-pole PFC + Full-Bridge GaN LLC
  • Benchmark 97.5 % of efficiency (optimized design to reduced cooling effort – reduction of air conditioning)
  • High power density 100 W/in³ (twice as much than the ORv3 specification)
  • Highest frequency in high-voltage LLC thanks to GaN transistors
  • Complete Power Supply Unit (PSU) including single-phase PFC + DCDC
  • Great system performance by enabled by hybrid switch approach – Si, SiC and GaN
  • Highest efficiency and power density
  • Following ORv3 form factor for server
  • Lower number of capacitors, to reduce volume, for higher reliability and condensed system size.
  • Available as reference board
  • CoolSiC™ MOSFET 650 V
  • CoolGaN™ Transistors 650 V
  • 600 V CoolMOS™ 8 SJ MOSFET
  • OptiMOS™ 5 Power MOSFET 80 V
  • OptiMOS™ 5 Power MOSFET 60 V
  • EiceDRIVER™ 1EDB, 1EDN, 2EDB
  • CoolSET™ flyback controller with integrated 800 V CoolMOS™
  • OPTIREG™ switches
  • ISOFACE™ digital isolator 
REF_8KW_HFHD_PSU: 8 kW power supply unit
Explore Infineon's REF_8KW_HFHD_PSU, a compact, 8 kW power supply design delivering 97.5% peak efficiency and 100 W/in³ power density. Built for AI and data center applications, it features advanced CoolMOS™, CoolSiC™, CoolGaN™, and OptiMOS™ technologies, along with a 500 kHz LLC switching frequency and 20 ms hold-up time. Discover how it supports next-gen infrastructure needs with unrivaled performance.
document

8 kW high power density and high frequency PSU for AI data centers and servers

Download now

  • Benchmark 97.5% efficiency @100 W/in³ including all/1U form factor
  • CoolSiC™, CoolGaN™, CoolMOS™,  OptiMOS™ technologies for highest efficiency and power density
  • Modular approach (2x 6 kW modules)
  • Multi-level topology
  • Novel, holistic control scheme
  • Full digital control
  • Complete power supply unit (PSU) including PFC + DC-DC
  • High efficiency, high power density
  • Modular design for superior light-load efficiency and ease of manufacturing
  • CoolSiC™ MOSFET 400 V
  • CoolGaN™ Transistor 100 V
  • 600 V CoolMOS™ 8 SJ MOSFET 
  • CoolSiC™ Schottky diode G5 650 V
  • EiceDRIVER™ 1EDB, 1EDN, 2EDB
  • CoolSET™ flyback controller with integrated 800 V CoolMOS™
  • ISOFACE™ digital isolator 
  • PSoC ™ and XMC™ microcontroller