Overview

Introducing EasyPACK™ S—smart, small, sizeable. The latest innovation in power electronics offers highest degree of automation in customer production line. With a compact 36x33x6 mm design, it enables system miniaturization and features robust thermal management, high reliability, and low EMI, making it a highly efficient solution for demanding applications and next-gen power electronics, empowering a new level of performance.

Key features
  • Compact package size
  • Fast and easy assembly process
  • High flexibility 
  • Automotive and industry qualified
  • PressFIT contact technology
  • Cost-effective module

About

What are the benefits of Infineon's EasyPACK™ S?

Infineon’s flexible power module EasyPACK™ S is designed to meet the diverse needs of various applications, offering different topologies and inverter geometries. With PressFIT pins, assembly and PCB mounting are made easy, reducing production time and costs. We utilize our benchmark chip technologies, carefully selecting components that match the specific requirements of your application. The result is a cost-effective module that delivers exceptional performance without compromising on reliability. 

With our high-volume manufacturing experience, you can rely on our module to meet the demands of your production line. Benefit from our expertise and discover a power module that combines flexibility, ease of use, and outstanding performance. Customizations to fit customer’s needs are possible by adding further chip technologies in different topologies.

Package

Introducing EasyPACK™ S—the newest member of the EasyPACK™ family—engineered for next-generation power electronics. Its ultra-compact 36x33x6 mm footprint drives system miniaturization without compromising performance. The robust, reliable module design is characterized by an easy design approach, which provides an integrated module solution with optimized thermal management. This simplifies the design-in process and ensures efficient heat dissipation.  The insulated package delivers high creepage and clearance distances for superior protection and reliable operation. Low stray inductance enables high-frequency switching and reduces EMI.

Technologies

EasyPACK™ S is future-ready, engineered to integrate seamlessly with emerging chip technologies while meeting stringent lifetime and reliability targets. Its scalable platform architecture delivers exceptional design flexibility—supporting diverse semiconductor technologies, power classes, and electrical configurations — so you can optimize performance and accelerate design-in. EasyPACK™ S provides a platform for different power classes using our leading IGBT, CoolSiC™ and CoolGaN™ technologies.

Automotive and Industry qualified EasyPACK™

EasyPACK™ S is engineered to meet the most demanding lifetime requirements, making it an ideal choice for forward-thinking companies seeking to stay at the forefront of their industry. Its future-ready design guarantees seamless integration with emerging chip technologies, while meeting the most stringent lifetime requirements.

Automated Processing

EasyPACK™ S offers unparalleled ease of use, ready for the highest degree of automation in customer production lines. Optimized for high-volume production, it streamlines manufacturing processes, including screwing and handling, to maximize customer efficiency. By achieving an optimal balance of cost and performance at the system level, the EasyPACK™ S sets a new standard for power electronics.

Applications

What are the benefits of Infineon's EasyPACK™ S?

Infineon’s flexible power module EasyPACK™ S is designed to meet the diverse needs of various applications, offering different topologies and inverter geometries. With PressFIT pins, assembly and PCB mounting are made easy, reducing production time and costs. We utilize our benchmark chip technologies, carefully selecting components that match the specific requirements of your application. The result is a cost-effective module that delivers exceptional performance without compromising on reliability. 

With our high-volume manufacturing experience, you can rely on our module to meet the demands of your production line. Benefit from our expertise and discover a power module that combines flexibility, ease of use, and outstanding performance. Customizations to fit customer’s needs are possible by adding further chip technologies in different topologies.

Package

Introducing EasyPACK™ S—the newest member of the EasyPACK™ family—engineered for next-generation power electronics. Its ultra-compact 36x33x6 mm footprint drives system miniaturization without compromising performance. The robust, reliable module design is characterized by an easy design approach, which provides an integrated module solution with optimized thermal management. This simplifies the design-in process and ensures efficient heat dissipation.  The insulated package delivers high creepage and clearance distances for superior protection and reliable operation. Low stray inductance enables high-frequency switching and reduces EMI.

Technologies

EasyPACK™ S is future-ready, engineered to integrate seamlessly with emerging chip technologies while meeting stringent lifetime and reliability targets. Its scalable platform architecture delivers exceptional design flexibility—supporting diverse semiconductor technologies, power classes, and electrical configurations — so you can optimize performance and accelerate design-in. EasyPACK™ S provides a platform for different power classes using our leading IGBT, CoolSiC™ and CoolGaN™ technologies.

Automotive and Industry qualified EasyPACK™

EasyPACK™ S is engineered to meet the most demanding lifetime requirements, making it an ideal choice for forward-thinking companies seeking to stay at the forefront of their industry. Its future-ready design guarantees seamless integration with emerging chip technologies, while meeting the most stringent lifetime requirements.

Automated Processing

EasyPACK™ S offers unparalleled ease of use, ready for the highest degree of automation in customer production lines. Optimized for high-volume production, it streamlines manufacturing processes, including screwing and handling, to maximize customer efficiency. By achieving an optimal balance of cost and performance at the system level, the EasyPACK™ S sets a new standard for power electronics.

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