The TRENCHSTOP™ 5 is the highest efficiency discrete IGBT technology on the market ideally suited for customers who are looking for outstanding efficiency and power density.
The TRENCHSTOP™ 5 IGBT technology has been released in 5 different variants - H5, F5, L5, WR5, S5 – optimized according to the switching frequencies and the best trade-off between switching and conduction losses required to deliver the highest performance in target applications such as Welding, UPS, Solar energy systems and Energy Storage.
Newly released TRENCHSTOP™ 5 in D2PAK package provides the higher power density IGBT for surface mounting (SMD) assembly.
Ultra-thin TRENCHSTOP™ 5 IGBT technology from Infineon allows higher power density in smaller chip size. Infineon is the first on the market able to fit 40 A 650 V IGBT with 40 A diode in D2PAK package – 25% higher than any other competitor offering maximum 30 A Duopack IGBT in D2Pak. Now the upgrade of the available SMD designs for higher power output Pout is possible.
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