Overview

Ultra-thin TRENCHSTOP™ 5 IGBT technology allows higher power density in a smaller chip size. Infineon is the first on the market to fit 40 A 650 V IGBT with 40 A diode in a D²PAK package - 25 percent higher than any other competitor, offering maximum 30 A Duopack IGBT in D²PAK. Now, the upgrade of the available SMD designs for up to 20 percent higher power is possible.

Key features
  • Highest power density
  • 25 percent higher current
  • Superior efficiency
  • Improved reliability
Applications
Energy storage systems
Uninterruptible power supplies (UPS)
Photovoltaic

Products

About

Key features

The TRENCHSTOP™ 5 in D²Pak incorporates important key features, e.g., the highest power density 650 V IGBT in D²Pak footprint, a 25 percent higher current than any other competitor, and the superior efficiency of leading TRENCHSTOP™ 5 technology. 

Key benefits

The key benefits are, among other things, the higher power design with D²Pak package, an upgrade of the available designs for higher power output, less paralleling for improved system reliability, less complexity, smaller PCB, more compact system design, and smaller weight.

Key features

The TRENCHSTOP™ 5 in D²Pak incorporates important key features, e.g., the highest power density 650 V IGBT in D²Pak footprint, a 25 percent higher current than any other competitor, and the superior efficiency of leading TRENCHSTOP™ 5 technology. 

Key benefits

The key benefits are, among other things, the higher power design with D²Pak package, an upgrade of the available designs for higher power output, less paralleling for improved system reliability, less complexity, smaller PCB, more compact system design, and smaller weight.

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