TDA21475
Active
RoHS Compliant

TDA21475

OptiMOS™ 70 A exposed-top power stage
Datasheet
package
ea.
in stock

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TDA21475
TDA21475
ea.
Datasheet


Product details


Recommended
OPN
TDA21475AUMA1
Product Status active
Infineon Package
PG-IQFN-39
Package Name N/A
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 2
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-IQFN-39
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 2
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
TDA21475 exposed-top power stage contains a low quiescent-current synchronous buck gate-driver IC co-packaged with a Schottky diode, high-side and low-side MOSFETs. The package is optimized for PCB layout, heat transfer, driver/MOSFET control timing, and minimal switch node ringing. The gate driver and MOSFET combination enables higher efficiency at the lower output voltages required by cutting edge CPU, GPU and DDR memory designs.

Features

  • Co-packaged driver and Schottky diode
  • Co-packaged high-side & low-side MOSFETs
  • 5-mV/A on-chip MOSFET current sensing
  • Input voltage (VIN) range of 4.25-16 V
  • VCC & VDRV supply of 4.25-5.5 V
  • Output voltage range 0.25-5.5 V
  • 70 A output OCP capability
  • Operation up to 1.5 MHz
  • VCC/VDRV under voltage lockout (UVLO)
  • Bootstrap capacitor UVP
  • 8-mV/°C temperature analog output
  • Thermal shutdown and fault flag

Benefits

  • Higher efficiency at lower out voltages
  • Robustness and reliability
  • Optimized PCB layout, heat & transfer
  • Optimized driver/MOSFET control timing
  • Minimal switch node ringing
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