IAUCN08S5N068T
NEW
Active and preferred
RoHS Compliant

IAUCN08S5N068T

NEW
80 V, N-Ch, 6.9 mΩ max, Automotive MOSFET, top-side cooled SSO10T (5x7), OptiMOS™ 5
Datasheet
package

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IAUCN08S5N068T
IAUCN08S5N068T
Datasheet


Product details

  • ID (@25°C) max
    80 A
  • Operating Temperature range
    -55 °C to 175 °C
  • Package
    PG-LHDSO-10
  • Planned to be available until at least
    2040
  • Polarity
    N
  • QG (typ @10V) max
    25.4 nC
  • QG (typ @10V)
    33 nC
  • Qualification
    Automotive
  • RDS (on) (@10V) max
    6.9 mΩ
  • Technology
    OptiMOS™5
  • VDS
    80 V
  • VGS(th) range
    2.2 V to 3.8 V
  • VGS(th)
    3 V

Recommended
OPN
IAUCN08S5N068TATMA1
Product Status active and preferred
Infineon Package
PG-LHDSO-10
Package Name N/A
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
MY
Country of Diffusion (CoD)
DE
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-LHDSO-10
Package Name -
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
MY
Country of Diffusion (CoD)
DE
IAUCN08S5N068T is an automotive MOSFET built with Infineon’sinnovative, top-side cooled SSO10T 5x7mm2 SMD package. The SSO10T package helps customers achieve big advancements in cooling and power density. This product also utilizes Infineon’s OptiMOS™ 5 80 V power semiconductor technology. It is designed specifically for the high performance, quality, and robustness needed for demanding automotive applications.

Features

  • Direct cooling path to ECU housing
  • Virtually no heat flows into PCB
  • Industry’s largest exposed pad area
  • Freedom to route traces under package
  • Can mount parts on back side of PCB
  • Fast switching times (turn on/off)
  • Extended qualification beyond AEC-Q101
  • Enhanced electrical testing
  • Package is listed with JEDEC

Benefits

  • Enables excellent thermal management
  • Thermal impedance improved 20% to 50%
  • Thermal resistance improved 20% to 50%
  • Helps reduce ECU volume or PCB area
  • Helps reduce PCB cost (area, Cu, vias)
  • Reduces PCB and system design effort
  • Superior switching performance
  • Quality and robustness for automotive
  • Potential for second source supplier
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