FF1MR12MM1H_B11
Active and preferred
RoHS Compliant

FF1MR12MM1H_B11

CoolSiC™ MOSFET half-bridge module 1200 V
ea.
in stock

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FF1MR12MM1H_B11
FF1MR12MM1H_B11
ea.


Product details

  • Applications
    EV Charger, CAV, UPS, Solar, ESS
  • Configuration
    Half-bridge
  • Dimensions (length)
    152 mm
  • Dimensions (width)
    62.5 mm
  • Features
    PressFIT
  • Housing
    EconoDUAL™ 3
  • Qualification
    Industrial
  • RDS (on)
    1.46 mΩ

OPN
FF1MR12MM1HB11BPSA1
Product Status active and preferred
Infineon Package AG-ECONOD
Package Name N/A
Packing Size 10
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
HU
Country of Diffusion (CoD)
MY
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package AG-ECONOD
Package Name -
Packing Size 10
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
HU
Country of Diffusion (CoD)
MY
ea.
in stock
EconoDUAL™ 3 CoolSiC™ MOSFET half-bridge module 1200 V, 1.46 mΩ with integrated NTC temperature sensor and PressFIT technology

Features

  • Low switching losses
  • Superior gate oxide reliability
  • Higher gate threshold voltage
  • Higher power output
  • Robust integrated body diode
  • High cosmic ray robustness
  • High speed switching module
  • Tvj op = 175°C overload
  • PressFIT pins
  • Screw power terminals
  • Integrated NTC temperature sensor
  • Isolated baseplate

Benefits

  • High switching frequency
  • Reduced volume and size
  • Reduction of system costs
  • High thermal efficiency
Documents

Design resources

Developer community