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×
Active and preferred
RoHS Compliant
F3L11MR12W2M1_B74
CoolSiC™ MOSFET 3-level module 1200 V
ea.
in stock
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F3L11MR12W2M1_B74
ea.
Product details
| Recommended | ||
|
OPN
|
F3L11MR12W2M1B74BOMA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-EASY2B | |
| Package Name | N/A | |
| Packing Size | 15 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | No | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-EASY2B |
| Package Name | - |
| Packing Size | 15 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
ea.
in stock
EasyPACK™ 2B CoolSiC™ MOSFET 3-level module in ANPC topology 1200 V, 11mΩ G1 with NTC and PressFIT contact technology.
Features
- Best-in-class packages with 12 mm height
- Leading edge WBG material
- Very low module stray inductance
- Enhanced CoolSiC™ MOSFET Gen 1
- Enlarged gate drive voltage window
- Gate-source voltages of +20 V and -10 V
- PressFIT pins
- Integrated NTC temperature sensor
Benefits
- Outstanding module efficiency
- System cost advantages
- System efficiency improvement
- Reduced cooling requirements
- Enabling higher frequency
- Increase of power density
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