F3L11MR12W2M1_B74
Active and preferred
RoHS Compliant

F3L11MR12W2M1_B74

CoolSiC™ MOSFET 3-level module 1200 V
Datasheet
ea.
in stock

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F3L11MR12W2M1_B74
F3L11MR12W2M1_B74
ea.
Datasheet


Product details

  • Applications
    ESS, SST, Solar, EV Charger
  • Configuration
    3-Level
  • Dimensions (length)
    62.8 mm
  • Dimensions (width)
    48 mm
  • Features
    PressFIT, phase leg
  • Housing
    Easy 2B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    11.3 mΩ

Recommended
OPN
F3L11MR12W2M1B74BOMA1
Product Status active and preferred
Infineon Package AG-EASY2B
Package Name N/A
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
CN,DE
Country of Diffusion (CoD)
AT
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY2B
Package Name -
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
CN,DE
Country of Diffusion (CoD)
AT
ea.
in stock
EasyPACK™ 2B CoolSiC™ MOSFET 3-level module in ANPC topology 1200 V, 11mΩ G1 with NTC and PressFIT contact technology.

Features

  • Best-in-class packages with 12 mm height
  • Leading edge WBG material
  • Very low module stray inductance
  • Enhanced CoolSiC™ MOSFET Gen 1
  • Enlarged gate drive voltage window
  • Gate-source voltages of +20 V and -10 V
  • PressFIT pins
  • Integrated NTC temperature sensor

Benefits

  • Outstanding module efficiency
  • System cost advantages
  • System efficiency improvement
  • Reduced cooling requirements
  • Enabling higher frequency
  • Increase of power density
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