BSB008NE2LX

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BSB008NE2LX
BSB008NE2LX

Product details

  • Ciss
    12000 pF
  • Coss
    3800 pF
  • ID (@25°C) max
    180 A
  • IDpuls max
    400 A
  • Micro-stencil
    IRF66MX-25
  • Mounting
    SMD
  • Operating Temperature
    -40 °C to 150 °C
  • Package
    DirectFET(M)
  • Polarity
    N
  • Ptot max
    89 W
  • QG (typ @4.5V)
    146 nC
  • QG (typ @10V)
    258 nC
  • RDS (on) (@10V) max
    0.8 mΩ
  • RDS (on) (@4.5V) max
    1 mΩ
  • RDS (on) (@4.5V LL) max
    1 mΩ
  • Rth
    1 K/W
  • Special Features
    Wide SOA
  • VDS max
    25 V
  • VGS(th)
    1.2 V to 2 V
OPN
Product Status
Infineon Package
Package Name
Packing Size
Packing Type
Moisture Level
Moisture Packing
Lead-free
Halogen Free
RoHS Compliant
Infineon stock last updated:
The OptiMOS™ 25V product familysets new standards in power density and energy efficiency. Lowest on-state resistance in small footprint packages make OptiMOS™ 25V the best choice for the demanding requirements of battery management, or-ing, e-fuse and hot-swap application. CanPAK™ package allows double sided cooling in thermally challenging applications.

Features

  • Lowest on-state resistance
  • High DC and pulsed current capability
  • Easy to design in
  • Double side cooling

Benefits

  • Increased battery lifetime/system efficiency
  • Saving space (reducing the number of devices needed)
  • Saving costs

Applications

Documents

Design resources

Developer community

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