Best choice for tomorrows high power automotive applications up to 280 A

Highest power density & efficiency in superior automotive quality

The success story of sTOLL 7x8 leadless packages continues with the latest OptiMOS-7™ 40 V technology as the leading-edge package for tomorrow's high power applications like EPS, braking, power- distribution, disconnect-switches and high-power BLDC drives.

sTOLL 7x8 offers high current capability of 280 A, more than the old leaded D²PAK (180 A), at an optimized footprint of 56 mm² which is even smaller than the old leaded DPAK (65 mm²).

sTOLL 7x8 in combination with the leading-edge OptiMOS-7™ 40 V power MOS technology combines for best in class power density and power efficiency at Infineon’s high-quality standard for robust automotive packages.

Consequently, the innovative sTOLL 7x8 package family supersedes the traditional leaded SMD packages like D²PAK (TO263) and DPAK (TO252) providing higher current capability in smaller form factor of 7x8 mm² at optimized thermal performance.

Further sTOLL 7x8 as leadless package minimizes stray inductances, package resistance and improves switching behavior over leaded packages significantly – the perfect match for robust & easy system designs.

sTOLL 7x8 is listed under JEDEC standard name MO-319 and IEC name HSOF-5 as open standard package.

For more information, please check our product presentation!

Key features
  • 7x8 mm² small footprint
  • 280 A high current capability
  • Available in leading-edge OptiMOS-7™ 40 V technology
  • RDS(on) range: 0.39 mΩ – 1.4 mΩ
  • Advanced leadless package with Cu-Clip for the lowest package resistance and minimized stray inductance
  • High avalanche capability and SOA ruggedness
  • AOI capable package for Automated Optical Inspection
  • JEDEC registered
  • PPAP Capable Device
Key benefits
  • Highest power and current density 
  • High thermal capacity lead-frame package 
  • Reduced conduction losses 
  • Optimized switching behavior 
  • Reduced form factor compared to traditional leaded packages
  • Industry standard package (JEDEC MO-319A)
  • Automotive robust package and quality by Infineon
Key applications
  • 12 V EPS
  • 12 V braking
  • 12 V high power BLDC
  • Power distribution
  • Zonal-architecture designs
  • Battery disconnect switch
  • Relay box
  • DC-DC

Package dimensions

HSOF-5-1 Package
HSOF-5-1 Package
HSOF-5-1 Package
Dimensions:
  • Body Length: 6.7 mm
  • Body Width: 7 mm
  • Min. Terminal Pitch: 1.3 mm 

Click here for a detailed information on the sToll Package PG-HSOF-5-1.

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