REF_WINLIFT_TLE9855
Window lift reference design with Embedded Power IC
The REF_WINLIFT_TLE9855 is a reference design developed for 2-phase automotive window lift systems.
- TLE9855QX: This device is a part of the Embedded Power IC family and it is a single chip H-Bridge motor driver, System-on-Chip (SoC) solution. It integrates an industry-standard Arm® Cortex®-M0 core along with LIN transceiver, bridge driver and power supply.
- IPZ40N04S5-3R1: This component is an OptiMOS™ 5 40 V in S3O8 Package and it combines leading power MOSFET technology with a 3.3 x 3.3 mm leadless power package for very compact and robust automotive system solutions. It is based on Infineon’s latest silicon automotive PowerMOS technology, optimized to meet and exceed the energy efficiency and power density requirements of automotive BLDC and H-bridge applications. In combination with Infineon’s robust S3O8 leadless package technology, it enables very small and efficient system designs with minimal RDS down to 2.8 mΩ.
- TLE4966G: This is device is an integrated circuit double Hall-effect sensor designed specifically for highly accurate applications in the automotive sector. Precise magnetic switching points and high-temperature stability are achieved by active compensation circuits and chopper techniques on-chip.
Summary of Features
- Reference for EMC and board size
- Optimized BOM and PCB size
- Power capability up to 200W
- SWD port for debug connection
- LIN, Panel and monitoring connector
- High-temperature FR4 PCB, 2-layer Copper
- Small 90x55 mm PCB size
- Extensive documentation including:
- layout files
- design guide
- schematics
- getting started guide
- hardware design guideline
- EMC report
Benefits
- Reduced time to market
- Minimal BOM and reduced PCB size
- State of the art components
- Scalability of the device
Potential Applications
- Car windows
Explore benefits of the reference design
The reference design provides recommendation for parts and layout. Moreover, it is a PCB-based design which takes less time in assembling a circuit in comparison to a leadframe solution.
Due to the highly integrated Embedded Power IC device and OptiMOS™-6 40 V MOSFET in sTOLL package, providing an ultra-small footprint, reference design offers minimal BOM and reduced PCB size.
The reference design is equipped with the best-in-class components with trusted Infineon quality sustaining product longevity.
Scalability of the Embedded Power IC device enables customer to extend the platform approach up to 1 kW.
