HybridPACK™ HD

HybridPACK™ HD CoolSiC™ MOSFET 1400V automotive qualified power modules designed to meet demanding requirements of electric commercial vehicles

Overview

HybridPACK™ HD extends our popular HybridPACK™ Drive portfolio to meet demanding heavy-duty requirements. Scalable performance enabled by .XT technology delivers from 500 A to 1,200 A RMS for applications from long-haul to city distribution. The module supports 1000 V battery operation today and is mechanically prepared for up to 1500 Vdc, enabling future megawatt charging without a redesign. Overall, it provides a compact, robust, and TCO-optimized inverter solution without module paralleling, while ensuring full future readiness.

Key Features

  • High output current
  • Long lifetime
  • High voltage ready
  • Compact design
  • Lower TCO

About

HybridPACK™ HD

To enable fast charging in heavy trucks with the Megawatt Charging System (MCS), the package is mechanically ready for battery voltages up to 1500 VDC. Its compact design and high robustness against vibration (qualified according to ISO 16750-3, Tests VII and IX) make the HybridPACK™ HD suitable for integration into an e-axle. The HybridPACK™ HD housing supports high currents up to 220°C RTI (Relative Thermal Index). Additionally, the housing features a slot for easy integration of the optional Swoboda CSM510HP2S/D current sensor module, which uses the Infineon XENSIV™ TLE4973 IC.

Current sensor selection guide

1400 V CoolSiC™ silicon carbide MOSFET

Silicon carbide (SiC) MOSFETs enable higher operating temperatures, faster switching frequencies, and improved power-conversion efficiency compared to conventional silicon-based semiconductors.

Infineon's CoolSiC™ MOSFET modules leverage advanced silicon carbide (SiC) technology to deliver increased power density, reduced cooling requirements, and lower system and operating costs. The benefits of SiC MOSFETs contribute to longer system lifetime, higher reliability, and improved overall efficiency in demanding power-electronics applications.

More about CoolSiC™ technology

.XT interconnection technology

.XT is a high-performance joining technology featuring sintered chips, Cu bond wires, and highly reliable system soldering. It enables exceptional power-cycling capability, supporting high reliability and a lifetime of over 1.5 million km, even under overload conditions.

More about .XT interconnection technology

Direct liquid-cooled baseplate with elliptical PinFins

The module power losses must be dissipated to ensure that the maximum permissible operating temperature specified in the datasheet is not exceeded. Therefore, the design of the cooling system/heat sink is of great importance. The HybridPACK™ HD features an optimized PinFin array on the baseplate, which enables highly effective liquid cooling. The baseplate is made of copper (Cu) and is plated with nickel (Ni).

FF01MR14A60MA2XT

FF01MR14A60MA2XT is the first released product in the HybridPACK™ HD CoolSiC™ MOSFET 1400 V power module family, featuring .XT technology and the following electrical characteristics: RDS(on) = 1 mΩ (at Tj = 25°C), IDN = 850 A, and IDRM = 1700 A.

More about FF01MR14A60MA2XT

HybridPACK™ HD

To enable fast charging in heavy trucks with the Megawatt Charging System (MCS), the package is mechanically ready for battery voltages up to 1500 VDC. Its compact design and high robustness against vibration (qualified according to ISO 16750-3, Tests VII and IX) make the HybridPACK™ HD suitable for integration into an e-axle. The HybridPACK™ HD housing supports high currents up to 220°C RTI (Relative Thermal Index). Additionally, the housing features a slot for easy integration of the optional Swoboda CSM510HP2S/D current sensor module, which uses the Infineon XENSIV™ TLE4973 IC.

Current sensor selection guide

1400 V CoolSiC™ silicon carbide MOSFET

Silicon carbide (SiC) MOSFETs enable higher operating temperatures, faster switching frequencies, and improved power-conversion efficiency compared to conventional silicon-based semiconductors.

Infineon's CoolSiC™ MOSFET modules leverage advanced silicon carbide (SiC) technology to deliver increased power density, reduced cooling requirements, and lower system and operating costs. The benefits of SiC MOSFETs contribute to longer system lifetime, higher reliability, and improved overall efficiency in demanding power-electronics applications.

More about CoolSiC™ technology

.XT interconnection technology

.XT is a high-performance joining technology featuring sintered chips, Cu bond wires, and highly reliable system soldering. It enables exceptional power-cycling capability, supporting high reliability and a lifetime of over 1.5 million km, even under overload conditions.

More about .XT interconnection technology

Direct liquid-cooled baseplate with elliptical PinFins

The module power losses must be dissipated to ensure that the maximum permissible operating temperature specified in the datasheet is not exceeded. Therefore, the design of the cooling system/heat sink is of great importance. The HybridPACK™ HD features an optimized PinFin array on the baseplate, which enables highly effective liquid cooling. The baseplate is made of copper (Cu) and is plated with nickel (Ni).

FF01MR14A60MA2XT

FF01MR14A60MA2XT is the first released product in the HybridPACK™ HD CoolSiC™ MOSFET 1400 V power module family, featuring .XT technology and the following electrical characteristics: RDS(on) = 1 mΩ (at Tj = 25°C), IDN = 850 A, and IDRM = 1700 A.

More about FF01MR14A60MA2XT
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