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Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Q3 FY 2026 concluded with record sales driven by strong AI business; further significant increase in revenue and margin expected in Q4 FY 2026
Infineon and LS ELECTRIC collaborate to advance high-efficiency direct current power solutions for AI data centers
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×
NEW
Active and preferred
RoHS Compliant
Lead-free
FF800R12KE7D_S8
NEW
1200 V, 800 A half-bridge IGBT module
ea.
in stock
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FF800R12KE7D_S8
ea.
Product details
-
Configurationhald-bridge
-
Dimensions (length)106.4 mm
-
Dimensions (width)61.4 mm
-
Housing62 mm
-
IC(nom) / IF(nom)800 A
-
IC max800 A
-
QualificationIndustrial
-
TechnologyIGBT7 - E7
-
VCE(sat)1.5 V
-
VCES / VRRM1200 V
-
VF (Tvj=25°C typ)1.8 V
-
Voltage Class max1200 V
| Recommended | ||
|
OPN
|
FF800R12KE7DS8HPSA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-62MMHB | |
| Package Name | N/A | |
| Packing Size | 10 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | Yes | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
| Country of Assembly (CoA) |
HU
|
|
| Country of Diffusion (CoD) |
DE,MY
|
|
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-62MMHB |
| Package Name | - |
| Packing Size | 10 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
HU
|
| Country of Diffusion (CoD) |
DE,MY
|
ea.
in stock
62 mm 1200 V, 800 A half-bridge low sat & fast trench IGBT module with TRENCHSTOP™ IGBT7, improved diode performance and 175°C continuous operation temperature.
Features
- Tvj op = 175°C continuous
- Highest power density
- Screw power terminals
- Isolated baseplate
- 20% improved diode performance
Benefits
- higher inverter output current
- less parallelization of the modules>
- reduction of total system cost
- reduced cooling efforts
Documents
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