FF17MR12W1M1H_B17
NEW
Active and preferred
RoHS Compliant

FF17MR12W1M1H_B17

NEW
EasyDUAL™ 1B CoolSiC™ MOSFET half-bridge module 1200 V
Datasheet
ea.
in stock

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FF17MR12W1M1H_B17
FF17MR12W1M1H_B17
ea.
Datasheet


Product details

  • Applications
    EV Charger, UPS, Solar
  • Configuration
    Half-bridge
  • Dimensions (length)
    62.8 mm
  • Dimensions (width)
    33.8 mm
  • Features
    PressFIT
  • Housing
    Easy 1B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    16.2 mΩ

Recommended
OPN
FF17MR12W1M1HB17BPSA1
Product Status active and preferred
Infineon Package AG-EASY1B
Package Name N/A
Packing Size 24
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
MY
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY1B
Package Name -
Packing Size 24
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
MY
ea.
in stock
EasyDUAL™ 1B 1200 V, 17 mΩ half-bridge module with CoolSiC™ MOSFET enhanced generation 1, integrated NTC temperature sensor and PressFIT Contact TechnologyEasyDUAL™ 1B 1200 V, 17 mΩ half-bridge module with CoolSiC™ MOSFET enhanced generation 1, integrated NTC temperature sensor and PressFIT Contact Technology

Features

  • CoolSiC™ MOSFET 1200 V
  • Common-source / Kelvin connection
  • Low gate-loop inductance
  • Fast switching capability
  • Low switching losses
  • High current capability
  • PressFIT pins
  • Integrated NTC temperature sensor

Benefits

  • High system efficiency
  • High switching frequency
  • High power density
  • Redeced cooling requirements
  • Improved switching performance
  • Lower EMI
  • More compact converter design
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