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×
Active and preferred
RoHS Compliant
F3L8MXTR12C2M2Q_H11
EasyPACK™ 2C CoolSiC™ MOSFET M2 .XT 3-level module 1200 V
ea.
in stock
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F3L8MXTR12C2M2Q_H11
ea.
Product details
-
ApplicationsDC-DC Converter, EV Charger, SST
-
Configuration3-level
-
Dimensions (width)62.8 mm
-
Dimensions (length)57.1 mm
-
Features.XT interconnection technology, PressFIT, TIM 2.0
-
HousingEasy 2C
-
QualificationIndustrial
-
RDS (on) (@ Tj = 25°C)8.3 mΩ
| Recommended | ||
|
OPN
|
F3L8MXTR12C2M2QH11BPSA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-EASY2C | |
| Package Name | N/A | |
| Packing Size | 18 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | No | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
| Country of Assembly (CoA) |
DE,TH
|
|
| Country of Diffusion (CoD) |
AT
|
|
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-EASY2C |
| Package Name | - |
| Packing Size | 18 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
DE,TH
|
| Country of Diffusion (CoD) |
AT
|
ea.
in stock
EasyPACK™ 2C CoolSiC™ MOSFET M2 .XT, 3-level module 1200 V, 8 mΩ with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Features
- Improved package concept
- .XT interconnection technology
- CoolSiC M2 chip technology
- High current PressFIT pins
- Integrated NTC temperature sensor
- Overload conditions up to Tvj over=200°C
- Enlarged gate-source voltage window
- Thermal interface material TIM 2.0
Benefits
- Outstanding module efficiency
- System efficiency improvement
- Enhanced lifetime
- High temperature withstand capability
- Reduction of static losses
- Compact design
- Full compability to Easy Pack B™
Applications
Diagrams
F3L8_Circut
×
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