AIM12S54EB1
NEW
Active and preferred
RoHS Compliant
Lead-free

AIM12S54EB1

NEW
CIPOS™ Maxi 1200 V, 25 A, three-phase Intelligent Power Module
Datasheet

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AIM12S54EB1
AIM12S54EB1
Datasheet


Product details

  • Additional Information
    Electrical
  • Built in NTC
    Yes
  • Configuration
    3 Phase Open Emitter
  • Encryption
    No
  • Language
    PLECS
  • Pmot (10kHz)
    7.6 kW
  • Product Category
    Intelligent Power Modules (IPM)
  • Product Group
    CIPOS™ Maxi
  • Product Name
    AIM12S54EB1
  • Qualification
    Automotive
  • Rated Current
    25 A
  • Switch Type
    CoolSiC™
  • Voltage Class
    1200 V

Recommended
OPN
AIM12S54EB1XKMA1
Product Status active and preferred
Infineon Package N/A
Package Name DIP 36x23DA
Packing Size 280
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
KR
Country of Diffusion (CoD)
MY
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package N/A
Package Name DIP 36x23DA
Packing Size 280
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
KR
Country of Diffusion (CoD)
MY
CIPOS™ Maxi, 1200 V, 25 A, three-phase CoolSiC™ MOSFET based intelligent power module with open emitter in DIP 36x23 package, providing fully-featured compact inverter solution with excellent thermal conduction for motor drives applications including industrial drives, fans and pumps, HVAC, active filters, and ect.

Features

  • Smallest 1200 V IPM package
  • Compact industrial & auto design
  • IGBT4, IGBT7, SiC G1/G2 options
  • Up to 15 kW with SiC G2
  • Power scaling, same footprint
  • Qualified for xEV auxiliaries
  • SiC G2 minimizes power losses
  • SOI driver with protection
  • Fewer parts, simpler PCB
  • No PCB redesign required

Benefits

  • Smallest 1200 V IPM package
  • Compact industrial & auto design
  • IGBT4, IGBT7, SiC G1/G2 options
  • Up to 15 kW with SiC G2
  • Power scaling, same footprint
  • Qualified for xEV auxiliaries
  • SiC G2 minimizes power losses
  • SOI driver with protection
  • Fewer parts, simpler PCB
  • No PCB redesign required
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Design resources

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