LGA-8 (002-10839)

PG-WLGA-8-801

Package details

  • Package Material
    PG
  • Package Family
    PG-WLGA
  • Terminals
    8
  • Variant
    801
  • Exposed Paddle
    No
  • Body Length (mm)
    5.0
  • Body Width (mm)
    6.0
  • Min. Terminal Pitch (mm)
    1.27
Infineon land grid array packages (LGA) for sensors are offered as various families. They are available as low profile (L), thin (T), very thin (V), and very very thin (W) versions. The package body may feature plastic overmold or metal lid. The micro electro-mechanical system (MEMS) for pressure or sound measurement may be exposed through an open signal port on the top or bottom of the body. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). In case the signal port is located in the landing area of the package special attention must be given to the vicinity of the solder joint. Typical products are MEMS microphones, pressures sensors, switches, and more.

Image Gallery

PG-WLGA-8-801_Footprint Drawing
PG-WLGA-8-801_Footprint Drawing
PG-WLGA-8-801_Footprint Drawing PG-WLGA-8-801_Footprint Drawing PG-WLGA-8-801_Footprint Drawing
PG-WLGA-8-801_Package Outline PG-WLGA-8-801_Package Outline PG-WLGA-8-801_Package Outline
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Documents and drawings

Documents and drawings