PG-TQFP-64-19

Package details

  • Package Material
    PG
  • Package Family
    PG-TQFP
  • Terminals
    64
  • Variant
    19
  • Exposed Paddle
    Yes
  • Body Length (mm)
    10.0
  • Body Width (mm)
    10.0
  • Min. Terminal Pitch (mm)
    0.5
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

SPO PG-TQFP-64-19
SPO PG-TQFP-64-19
SPO PG-TQFP-64-19 SPO PG-TQFP-64-19 SPO PG-TQFP-64-19
FPD PG-TQFP-64-19 FPD PG-TQFP-64-19 FPD PG-TQFP-64-19

Documents and drawings