CERAMIC-SOP-16 (002-23171)

CG-SSOP-16-800

Package details

  • Package Material
    CG
  • Package Family
    CG-SSOP
  • Terminals
    16
  • Variant
    800
  • Exposed Paddle
    No
  • Body Length (mm)
    10.45
  • Body Width (mm)
    7.45
  • Min. Terminal Pitch (mm)
    1.27
Infineon ceramic small outline packages (SOP) are offered as different families. They are available as shrink (S) and thin (T) versions. Alternative and legacy designations may include CER-TSOP-II. The dual row gullwing shaped leads allow for high-throughput board mounting using surface mount technology (SMT). Typical products include memory for space applications.

Image Gallery

CG-SSOP-16-800_Package Outline
CG-SSOP-16-800_Package Outline
CG-SSOP-16-800_Package Outline CG-SSOP-16-800_Package Outline CG-SSOP-16-800_Package Outline

Documents and drawings