PG-LHSOF

Infineon heat sink small outline flat leaded (HSOF) packages are offered as various families. They are available as low profile (L) versions. Alternative designations for HSOF-7 and HSOF-8 variants are TO-leadless (TOLL) while the HSOF-5 represent a shrink version (sTOLL). It can also be found under HSOF-5 designations. The plastic packages carry the die on a leadframe that is optimized for heat dissipation. The semi-flat connection design allows for high-throughput board mounting using surface mount technology (SMT). The terminations have an additional lead tip inspection (LTI) feature for automated optical inspection (AOI) of wettable flanks. The footprints feature near-one axis symmetry which calls for extra consideration during the board mounting design. Typical products are MOSFET, n-channel, and GaN transistors, as well as switches.