PG-DFN

Infineon dual flat nonleaded packages (DFN) for pressure sensors are offered as different variants. The leadframe based cavity type packages feature a centrally arranged micro-electro-mechanical system (MEMS) sensor chip. The leadless connection design allows for high-throughput board mounting using surface mount technology (SMT). The terminations offer additional lead tip inspection (LTI) features for automated optical inspection (AOI) of wettable flanks. The open signal ports in the covering lid call for extra consideration during board mounting processes. Typical products are space-efficient solutions e.g. for barometric (BAP) & manifold (MAP) sensors, pressure sensors for side crash detection (SAB), and tire pressure sensors (TPMS).