C-DIP

Infineon offers ceramic dual inline packages (DIP). Legacy designations may include CERDIP. The straight lead termination design allows for high robustness board mounting using through-hole technology (THT). The leads of THD are inserted in drilled holes of the board prior to soldering. During pre-mount processing special care must be taken e.g. during lead bending. Typical products are rad hard power ICs, dual and quad channel high reliability power MOSFETs and memories for space applications.