Active and preferred
RoHS Compliant
Lead-free

OPTIGA TPM SLB 9673 FW26

Ready-to-use TPM optimized for embedded systems featuring I2C interface and PQC-protected firmware update mechanism
Multiple OPNs available
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OPTIGA TPM SLB 9673 FW26
OPTIGA TPM SLB 9673 FW26
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Product details

  • Additional Information
    Version 2.0 Rev. 01.59
  • Ambient Temperature
    -40 °C to 105 °C, -40 °C to 85 °C
  • Applications
    trusted computing
  • Asymmetric Cryptography
    RSA3072, ECC NIST P384, ECC BN256, ECC NIST P256, RSA4096, RSA2048, RSA1024
  • Certifications
    FIPS 140-2 level 2, CC EAL4+
  • CPU
    32-bit
  • Delivery Forms
    UQFN-32
  • Interfaces
    I2C
  • NVM
    51 kByte
  • Package
    UQFN-32
  • Product Description
    FW26.xx, I2C TPM for embedded systems
  • Symmetric Cryptography
    SHA-1, HMAC, SHA2-256, SHA2-384, AES-128, AES-192, AES-256
  • Use Cases
    Embedded TPM
OPN
SLB9673XU20FW2624XTMA1 SLB9673AU20FW2624XTMA1 SLB9673XU20FW2613XTMA1 SLB9673AU20FW2613XTMA1 SLB9673XU20FW2610XTMA1 SLB9673AU20FW2610XTMA1
Product Status active and preferred active and preferred not for new design not for new design discontinued discontinued
Infineon Package
Package Name N/A N/A N/A N/A N/A N/A
Packing Size 5000 5000 5000 5000 5000 5000
Packing Type TAPE & REEL TAPE & REEL TAPE & REEL TAPE & REEL TAPE & REEL TAPE & REEL
Moisture Level 1 1 1 1 1 1
Moisture Packing NON DRY NON DRY NON DRY NON DRY NON DRY NON DRY
Lead-free Yes Yes Yes Yes Yes Yes
Halogen Free Yes Yes Yes Yes Yes Yes
RoHS Compliant Yes Yes Yes Yes Yes Yes
Infineon stock last updated:
ea. in stock ea. in stock ea. in stock

Product Status
Active
Infineon Package
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status
Active
Infineon Package
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status not for new design
Infineon Package
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status not for new design
Infineon Package
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status discontinued
Infineon Package
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status discontinued
Infineon Package
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
OPTIGA™ TPM SLB 9673 FW26.xx is targeted at connected devices that require enhanced security features. It comes with an I2C interface and serves as a robust foundation to identify and authenticate network infrastructure devices and equipment as well as industrial machines such as factory robots and programmable logic controllers (PLC). It is future-proof thanks to a PQC-protected firmware update mechanism, extended memory, and strong algorithms.

Features

  • I2C interface up to 1 MHz
  • Extended non-volatile memory (51 kB)
  • Asym. Crypto up to RSA-4k & ECC P384
  • Symmetric crypto up to AES 256
  • Hash up to SHA2-384
  • Enhanced security features
  • TCG, CC and FIPS 140-2 certifications
  • Compliant w/ TCG TPM Lib. Spec (v.1.59)
  • Compliant w/ TCG PC Client PTP (v.1.05)
  • PQC-protected FW update mechanism

Benefits

  • Proven, turnkey security solution
  • High confidence level (CC/FIPS certs)
  • Faster cryptographic operations
  • Easy integration w/ Windows/Linux OS Pl.

Diagrams

Overview of differences in the OPTIGA™ TPM features and applications
Overview of differences in the OPTIGA™ TPM features and applications
Overview of differences in the OPTIGA™ TPM features and applications Overview of differences in the OPTIGA™ TPM features and applications Overview of differences in the OPTIGA™ TPM features and applications
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Documents

Design resources

Developer community

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