Account

Log In

Register

myInfineon Benefits

My dashboard

Notifications

Bookmarks

My cases

myICP

Profile center

Logout
Account

Log In

Register

myInfineon Benefits

My dashboard

Notifications

Bookmarks

My cases

myICP

Profile center

Logout

Home

Biometric Authentication & Access Webinar

Digital Webinar – Fingerprint biometrics in authentication & access

Webinar on-demand

In the rapidly evolving landscape of security and authentication, the adoption of fingerprint biometrics has gained remarkable traction. This webinar will provide valuable insights into this and its transformative impact on security and convenience for different enterprise and government applications. Join us to stay ahead of the curve in this rapidly advancing field.

1. Key takeaways:

The role of fingerprint biometrics in shaping the future of convenience
Why organizations should consider authentication and access devices with integrated fingerprint sensors
Introducing new biometric smart card technologies: features, benefits, and potential use cases
Embracing biometrics: migration towards a more convenient and interconnected world

Meet our experts virtually and get the chance to engage with them and ask your questions live!

2. Speakers

Nicole Wagner

Nicole Wagner's expertise lies in hardware-bound authentication and access solutions, with a focus on enterprise, government, and predominantly organizational use cases. As a Product Marketing Manager at Infineon Technologies, she oversees the global authentication and the physical and logical access portfolio, which includes the management of Infineon’s security controllers for smart card applications, USB tokens, and FIDO security keys. Nicole holds a Master's Degree in Management & Technology from the Technical University of Munich, Germany

Philip Seebauer

Philip Seebauer is a packaging expert in the field of Smart Card and passports, his journey commenced at Infineon Technologies in 2014. Starting as a Process Development Engineer. His ascent through the ranks led him to pivotal roles in Product and Technical Marketing, where he now orchestrates the technical definitions for packaging, bumping, pre-assembly, and assembly technologies on a global scale. He seamlessly blends engineering expertise with market foresight, his contributions have been instrumental in steering Infineon's product solutions to meet the intricate demands of a rapidly evolving technology landscape. His knowledge in Smart Card Packaging, Bumping Techniques, and Assembly Technologies render him an invaluable asset to the industry.