IM73D122 | Ultra-low noise high sensitivity digital XENSIV™ MEMS microphone

Overview

Ultra-low noise digital XENSIV^TM MEMS microphone IM73D122 is designed for applications which require a very high SNR (low self-noise) and a high sensitivity. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of multi-microphone (array) applications. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level.

The powerful mix of ultra-high SNR and high sensitivity empowers high quality audio capturing for voice user interface applications in laptops, tablets or conferencing devices.

Summary of Features

Ultra-low self-noise/ultra-high SNR 73dB(A)
Very high sensitivity (-26 dBFS)
Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
High dynamic range and acoustic overload point (AOP) of 122 dBSPL
Very tight part-to-part phase and sensitivity matching (± 1dB)
Flat frequency response with a low LFRO (low frequency roll-off) of 20Hz
Very low group delay (7µs @ 1kHz)

Benefits