F3L11MR12W2M1HP_B19
Active and preferred
RoHS Compliant

F3L11MR12W2M1HP_B19

CoolSiC™ MOSFET 3-level module 1200 V
Datasheet
package
ea.
in stock

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F3L11MR12W2M1HP_B19
F3L11MR12W2M1HP_B19
ea.
Datasheet


Product details

  • Applications
    UPS, Solar, EV Charger, ESS
  • Configuration
    Sixpack
  • Dimensions (length)
    62.8 mm
  • Dimensions (width)
    48 mm
  • Features
    PressFIT, TIM
  • Housing
    Easy 2B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    10.8 mΩ

Recommended
OPN
F3L11MR12W2M1HPB19BPSA1
Product Status active and preferred
Infineon Package
AG-EASY2B
Package Name N/A
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
AG-EASY2B
Package Name -
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
ea.
in stock
EasyPACK™ 2B CoolSiC™ MOSFET 3-level module in NPC2 topology 1200 V, 11mΩ G1 with NTC, pre-applied thermal interface material (TIM) and PressFIT contact technology.

Features

  • Best-in-class packages with 12 mm height
  • Leading edge WBG material
  • Very low module stray inductance
  • Enhanced CoolSiC™ MOSFET Gen 1
  • Enlarged gate drive voltage window
  • Gate-source voltages of +23 V and -10 V
  • Tvjop under overload condition up to 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor
  • Thermal Interface Material (TIM)

Benefits

  • Outstanding module efficiency
  • System cost advantages
  • System efficiency improvement
  • Reduced cooling requirements
  • Enabling higher frequency
  • Increase of power density
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