OptiMOS™ power MOSFET Source-Down family with industry leading RDS(on) and superior thermal performance
Infineon’s OptiMOS™ low-voltage power MOSFETs present an innovative and improved PQFN package concept with Source-Down technology. With this new package, the silicon is flipped upside down inside of the component. This leads to the source potential connected to the PCB over the thermal pad instead of the drain potential.
The OptiMOS™ power MOSFET 3.3x3.3mm Source-Down package is now available in 25V and 40V. A full portfolio, ranging from 25V up to 150V, will be released in 2021.
This new technology comes in two different footprint versions: a Source-Down version and a Source-Down Center-Gate version which is specifically optimized for parallelization. Compared to alternative solutions, Source-Down offers benefits like lower RDS(on) and improved thermal performance. Additionally, less active cooling and a more effective layout for thermal management is provided through Source-Down technology. The OptiMOS™ low-voltage power MOSFET family in PQFN 3.3x3.3 Source-Down targets drives, telecom, SMPS and server applications.