SLC36/37 40nm
Our new 40nm SLC3x security platform provides excellent performance and flexibility for Payment, Ticketing and Access applications
The 40nm platform products offer best-in-class contactless performance based on a powerful and energy-efficient 32-bit ARM® SecurCore® SC300™ dual-interface security crypto controller in combination with SOLID Flash™ memory concept.
Customers can benefit from a fast time to market due to the 40nm family concept. This reduces development effort by accelerating product design as it allows easy Software migration from our 65nm SLC32 platform with fast approval and short lead times based on innovative logistic concepts.
The SLC3x security concept builds on a high-speed coprocessor supporting both symmetrical cryptography (with AES and DES) and asymmetrical cryptography (with certified RSA and ECC libraries).
Chip security is further enhanced by the AIS 20/31-compliant Hybrid Random Number Generator, which uses a physical noise source and features built-in cryptographic post-processing.
Furthermore the new 40nm technology platform is also the basis for the next generation SECORA™ solution offerings for Payment and ID.
- Optimize time-to-market: The SLC3x 40nm product series offers fastest design-in supporting a wide range of applications from the smallest to the most powerful chip in the market, thus optimizing R&D resources.
- Excellence in converging markets: The state-of-the-art Arm® SecurCore® SC300 chip architecture of the 40nm SLC3x series boosts contactless performance for extremely demanding payment and multi-application use cases.
- Best fit for all regional variances: This product offering is designed for global markets while still supporting regional requirements and local certifications. Infineon's excellent customer support teams at regional level enable very fast time-to-market.
- Innovations platform: The 40nm platform and its enhanced feature set support emerging market trends such as biometric authentication. Innovative, ready-to-use delivery forms such as the SPA modules enable very fast design of new form factors - within just a few weeks.
