ISO1I813T
Active and preferred
RoHS Compliant
Lead-free

ISO1I813T

8-ch digital input IC with integrated 500VRMS isolation, channel resolved wire-break diagnostics and 3-level VBB monitoring for industrial automation.
Datasheet
package
ea.
in stock

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ISO1I813T
ISO1I813T
ea.
Datasheet


Product details

  • Budgetary Price €/1k
    2.76

Recommended
OPN
ISO1I813TXUMA1
Product Status active and preferred
Infineon Package
PG-TSSOP-48
Package Name N/A
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Country of Assembly (CoA)
PH
Country of Diffusion (CoD)
DE
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TSSOP-48
Package Name -
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
PH
Country of Diffusion (CoD)
DE
ea.
in stock
ISOFACE™ ISO1I813T is a high featured system solution for IEC 61131-2 compliant digital inputs in industrial automation with detailed diagnostic feedback per channel. Its 8 channels offer configurable sensor level detection for Type 1, 2 and 3 sensors and precisely regulate the sensor current to reduce power dissipation effectively. The sensor data captured by the IC is reliably transferred to the µC domain via integrated galvanic isolation.

Features

  • 8 channels for Type 1, 2 and 3 sensors
  • Precise sensor current regulation
  • Adj. sampling frequency up to 500 kHz
  • VISO = 500Vrms isolation voltage
  • Digital filter per ch (off + 8 settings)
  • SPI, parallel Interface
  • Detailed VBB monitoring (3 levels)
  • Per channel sensor wire-break diagnosis
  • Synchronous data acquisition
  • Opt. VBB self-supply (internal DC/DC)
  • IEC 61131-2 compliant

Benefits

  • High system robustness
  • Low power dissipation
  • Flexible noise filtering
  • Excellent noise robustness
  • No isolation aging effects
  • Fast and efficient fault localization
  • Supports fast factory installation
  • Supports predictive maintenance
  • Reduced maintenance efforts
  • Compact high-density I/O module design
  • Supports self-supplied designs
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