NEW
Active and preferred
RoHS Compliant

FF4MR12W2M1HP_B11_A

NEW
AQG324 qualified CoolSiC™ MOSFET halfbridge module for EV power conversion and eAviation ecosystem
Data Sheet

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FF4MR12W2M1HP_B11_A
FF4MR12W2M1HP_B11_A
Data Sheet

Product details

  • Applications
    EV Charger, OBC, UPS, SPU
  • Configuration
    Half-bridge
  • Dimensions (width)
    48 mm
  • Dimensions (length)
    62.8 mm
  • Features
    TIM, PressFIT
  • Housing
    Easy 2B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    4 mΩ
Recommended
OPN
FF4MR12W2M1HPB11ABPSA1
Product Status active and preferred
Infineon Package AG-EASY2B
Package Name N/A
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package AG-EASY2B
Package Name -
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
AQG324 qualified EasyDUAL™ 2B CoolSiC™ MOSFET halfbridge module 1200V, 4 mΩ with NTC temperature sensor, pre-applied Thermal Interface Material and PressFIT Contact Technology for EV power conversion and eAviation ecosystem

Features

  1. Best in class package with 12mm height
  2. Leading edge WBG material
  3. CoolSiC™ for high switching frequencies
  4. Lowest RDSon and FIT rate
  5. Pre-applied Thermal Interface Material
  6. Available with PressFIT Pin and Solder Pin

Benefits

  1. Compact and lightweight design
  2. Reduced system size and weight
  3. Reliable package concept
  4. Increased power density and high efficiency
  5. Reduced development time and costs
  6. AQG324 qualified to support automotive standards

Diagrams

Circuit diagram FF4MR12W2M1HP_B11_A
Circuit diagram FF4MR12W2M1HP_B11_A
Circuit diagram FF4MR12W2M1HP_B11_A Circuit diagram FF4MR12W2M1HP_B11_A Circuit diagram FF4MR12W2M1HP_B11_A
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