TQFP-128 (51-85101)

PG-TQFP-128-800

Package details

  • Package Material
    PG
  • Package Family
    PG-TQFP
  • Terminals
    128
  • Variant
    800
  • Exposed Paddle
    No
  • Body Length (mm)
    13.995
  • Body Width (mm)
    19.99
  • Min. Terminal Pitch (mm)
    0.5
  • TRAY
    Pieces/Reel
    Reels/Box
     
    360
    5
  • TRAY
    Pieces/Reel
    Reels/Box
     
    720
    10
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    750
    1
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-TQFP-128-800_Package Outline
PG-TQFP-128-800_Package Outline
PG-TQFP-128-800_Package Outline PG-TQFP-128-800_Package Outline PG-TQFP-128-800_Package Outline
PG-TQFP-128-800_Footprint Drawing PG-TQFP-128-800_Footprint Drawing PG-TQFP-128-800_Footprint Drawing
PG-TQFP-128-800_Bakeable Trays PG-TQFP-128-800_Bakeable Trays PG-TQFP-128-800_Bakeable Trays
PG-TQFP-128-800_Tape and Reel_01 PG-TQFP-128-800_Tape and Reel_01 PG-TQFP-128-800_Tape and Reel_01

Documents and drawings