NEW
Active and preferred
RoHS Compliant

EV GMC HPD2 FU FS980 08

NEW
HybridPACK™ Drive G2 Fusion power module with sensors & gate driver, compatible with Logic Board & Interface PCB

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EV GMC HPD2 FU FS980 08
EV GMC HPD2 FU FS980 08

Product details

  • Applications
    Automotive SiC & IGBT Modules
  • Board Type
    Evaluation Board, Reference Board
  • Description
    Pre-assembled kit: HybridPACK™ Drive G2 Fusion power module mounted on a reference cooler, equipped with three Swoboda phase current sensors and a gate driver board using 1EDI3035AS gate drivers. The kit is compatible with the Logic Board and Interface PCB
  • Family
    Si/SiC Fusion Modules
  • Input Type
    DC
  • Interfaces
    PWM & IO
  • Product Name
    The Evaluation Kit for HybridPACK™ Drive G2 Fusion
  • Qualification
    Automotive
  • Sub Application
    SiC and IGBT Modules, Automotive
  • Target Application
    Automotive, Motor Control & Drives, Electromobility, E-Bikes & Small E-Vehicles
  • Topology
    B6 Bridge
OPN
EVGMCHPD2FUFS98008TOBO1
Product Status active and preferred
Infineon Package --
Package Name N/A
Packing Size 1
Packing Type CONTAINER
Moisture Level N/A
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package --
Package Name -
Packing Size 1
Packing Type CONTAINER
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Pre-assembled kit consisting of a HybridPACK™ Drive G2 Fusion power module mounted on a reference cooler, equipped with three Swoboda phase current sensors and a gate driver board using 1EDI3035AS gate drivers. The kit is compatible with the Logic Board and Interface PCB.

Features

  • B6 bridge: 470Vdc, 750Arms
  • High efficiency SiC MOSFET Gen2
  • Rugged IGBT/Diode EDT3
  • Optimized for simultaneous switching (single gate drive)

Benefits

  • Faster time-to-market
  • Fast eval. HybridPACK™ Drive G2 Fusion power module
  • Reduced design risk

Applications

Documents

Design resources