PQFN 8x6

PQFN 8x6 - the latest high performance, high current and high power-density package solution – TOLL performance in half the package size

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Overview

New PQFN 8x6 is a high performance, high power density clip-based package optimized for currents up to 650 A. A footprint reduction of > 50% compared to TOLL, together with a height reduction of 100%, results in an overall space saving of >70% enabling compact designs. The seamless backward compatibility of this package with PQFN 5x6 enables power scalability of the same board or less paralleling of MOSFETs.

Key Features

  • High current capability
  • FOMg Compact 8.0x6.0 mm2 footprint
  • ­Enables industry-best RDS(on) and FOM
  • Latest OptiMOSTM MOSFET technology
  • Leadless package similar to PQFN 5x6
  • Ultra-low package parasitics
  • Footprint compatibility with PQFN 5x6

Products

About

PQFN 8x6 Benefits
  • Increased power density allows higher power designs in a compact board space
  • Very low conduction losses, Low thermals and less device paralleling
  • Low EMI
  • Delivers benchmark performance with best-in-class power density and power efficiency
  • Simpler PCB design with scalability across various power levels
PQFN 8x6 Performance Advantage

PQFN 8x6 is a power-packed innovative package solution the fills the gap between PQFN 5x6 and TOLL. It can achieve high power levels similar to TOLL in a compact 48 mm2 footprint which is slightly larger than PQFN 5x6 (30 mm2). High power levels of 1-1.35 kW of continuous power can be achieved with PQFN 8x6.

Less paralleling of MOSFETs with PQFN 8x6

PQFN 8x6 can easily replace two PQFN 5x6 products with similar performance. This enables reducing overall part count with a robust single-chip solution and reducing board space by 27%.

PQFN 8x6 Benefits
  • Increased power density allows higher power designs in a compact board space
  • Very low conduction losses, Low thermals and less device paralleling
  • Low EMI
  • Delivers benchmark performance with best-in-class power density and power efficiency
  • Simpler PCB design with scalability across various power levels

PQFN 8x6 Performance Advantage

PQFN 8x6 is a power-packed innovative package solution the fills the gap between PQFN 5x6 and TOLL. It can achieve high power levels similar to TOLL in a compact 48 mm2 footprint which is slightly larger than PQFN 5x6 (30 mm2). High power levels of 1-1.35 kW of continuous power can be achieved with PQFN 8x6.

Less paralleling of MOSFETs with PQFN 8x6

PQFN 8x6 can easily replace two PQFN 5x6 products with similar performance. This enables reducing overall part count with a robust single-chip solution and reducing board space by 27%.

Documents

Documents

Design resources

Developer community

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