Thin-TOLL 8x8

The next evolutionary step for higher power density in low to medium power applications

Overview

Infineon’s Thin-TOLL 8x8 package is a clever cross between a Thin-PAK 8x8 and a TOLL package. The thicker Thin-TOLL leadframe allows tolerating a higher number of TCoB (thermal cycles on board) - up to 4 times than other 8x8 packages. The support for .XT package interconnect enables a Tj of 175°C, when a CoolSiC™ die is used.

Key Features

  • SMD bottom-side cooled package
  • Fully compatible 8x8 mm footprint
  • Mold body thickness of 1.5 mm
  • Lead pitch of 2 mm
  • Tj,max of 175°C
  • TCoB close to TOLL package

Products

Design resources

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