Thin-TOLL 8x8

The next evolutionary step for higher power density in low to medium power applications

Overview

Infineon’s Thin-TOLL 8x8 package is a clever cross between a Thin-PAK 8x8 and a TOLL package. The thicker Thin-TOLL leadframe allows tolerating a higher number of TCoB (thermal cycles on board) - up to 4 times than other 8x8 packages. The support for .XT package interconnect enables a Tj of 175°C, when a CoolSiC™ die is used.

Key Features

  • SMD bottom-side cooled package
  • Fully compatible 8x8 mm footprint
  • Mold body thickness of 1.5 mm
  • Lead pitch of 2 mm
  • Tj,max of 175°C
  • TCoB close to TOLL package

Products

About

Benefits of Thin-TOLL 8x8

The Thin-TOLL 8x8 supersedes the ThinPAK 8x8 providing 5x more or 8921cycles of TCoB capability due to .XT interconnect technology. Its compact bottom side cooled device, making it ideal to lower the system cost of TOLL, D2Pak or DPAK designs while providing longer lifetime.

.XT interconnect technology

Infineon’s proprietary .XT package interconnect technology involves diffusion soldering for extremely robust die attach, which improves not only reliability but also the Rth. 

Thin-TOLL 8x8 portfolio

The Thin-TOLL 8x8 package features a small footprint and high power capability, enabling high power density designs. The portfolio is comprised of the latest CoolMOS™ 8 and CoolSiC™ G2 MOSFET technologies. CoolMOS™ 8 is Infineon’s latest high voltage super-junction MOSFET technology and comes with integrated fast body diode targeting a broad variety of applications.  CoolSiC™ G2 SiC MOSFETs offer superior power density and performance with high thermal conductivity. 

Benefits of Thin-TOLL 8x8

The Thin-TOLL 8x8 supersedes the ThinPAK 8x8 providing 5x more or 8921cycles of TCoB capability due to .XT interconnect technology. Its compact bottom side cooled device, making it ideal to lower the system cost of TOLL, D2Pak or DPAK designs while providing longer lifetime.

.XT interconnect technology

Infineon’s proprietary .XT package interconnect technology involves diffusion soldering for extremely robust die attach, which improves not only reliability but also the Rth. 

Thin-TOLL 8x8 portfolio

The Thin-TOLL 8x8 package features a small footprint and high power capability, enabling high power density designs. The portfolio is comprised of the latest CoolMOS™ 8 and CoolSiC™ G2 MOSFET technologies. CoolMOS™ 8 is Infineon’s latest high voltage super-junction MOSFET technology and comes with integrated fast body diode targeting a broad variety of applications.  CoolSiC™ G2 SiC MOSFETs offer superior power density and performance with high thermal conductivity. 

Design Resources Component

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