EasyPACK™ HD3

EasyPACK™ HD3 is a high-density, baseplate-equipped module, designed for next-generation PV, ESS and power supply systems

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Overview

EasyPACK™ HD3 sets a new standard in the Easy family as the first module with an integrated baseplate, combining high power density and advanced durability. Specially designed for the next generation of PV, ESS  and power supply  converters, EasyPACK™ HD3 brings exceptional power handling to high-voltage, high-current applications. Its robust construction and leading-edge materials enable operation at up to 2000 V DC and support single-module power levels over 400 kW, giving designers the freedom to achieve outstanding system efficiency and reliability.

Key Features

  • Baseplate design for high power density and high voltage
  • High-performance substrate
  • Reliable pin rivet connection
  • Flexible pin grid: high-current solder or PressFIT pins
  • CTI 600 materials for high insulation
  • Advanced thermal gel
  • Latest chip technologies

Products

About

What are the benefits of Infineon’s EasyPACK™ HD3?

Infineon’s EasyPACK™ HD3 sets new benchmarks in continuous operation, supporting a continuous junction temperature (Tvj) of 175°C, while enabling long-term thermal and mechanical stability. Designed to deliver high power ratings at exceptional density, EasyPACK™ HD3 supports DC systems up to 2000 V and enables low stray inductance operation for peak system efficiency. Continuous innovation and best-in-class chip technology integration ensure the ideal match for the toughest application requirements, from grid-tied solar to next-level energy storage. Featuring robust materials and high-reliability assembly, the EasyPACK™ HD3 makes large-scale production straightforward, while supporting flexible customization for your project needs.

Package

The EasyPACK™ HD3 pushes the boundaries of the Easy family, featuring a thermally optimized baseplate that enables around 15% improved Rthjh , translating to best-in-class output power and increased reliability - even under extreme stress modes (such as LVRT in PV or triple overload in ESS). With housing constructed from high-CTI 600 materials for 2000 V+ DC bus voltages and advanced gel for superior insulation, EasyPACK™ HD3 stands up to the most demanding operational environments. Available in both 12 mm and 15 mm design heights, its flexible pin grid supports high-current solder or PressFIT pins to enable double the current rating and lower PCB temperatures, while retaining compatibility with the Easy 3B pin grid.

Technologies

EasyPACK™ HD3 is featuring the latest Infineon technologies, including state-of-the-art CoolSiC™ MOSFETs, the newest TRENCHSTOP™ IGBT7 & IGBT8, and high-performance diodes. All are a perfect fit for industry-leading efficiency and reliability, supporting single-module solutions up to 400 kW, and power architectures such as 3-level NPC1 and 3-level boost. The platform is tailored for utility-scale solar inverters (300 kW+), advanced energy storage, and UPS AI Datacenter applications, empowering designers to achieve groundbreaking system performance, lower system losses, and maximize component lifespan.

What are the benefits of Infineon’s EasyPACK™ HD3?

Infineon’s EasyPACK™ HD3 sets new benchmarks in continuous operation, supporting a continuous junction temperature (Tvj) of 175°C, while enabling long-term thermal and mechanical stability. Designed to deliver high power ratings at exceptional density, EasyPACK™ HD3 supports DC systems up to 2000 V and enables low stray inductance operation for peak system efficiency. Continuous innovation and best-in-class chip technology integration ensure the ideal match for the toughest application requirements, from grid-tied solar to next-level energy storage. Featuring robust materials and high-reliability assembly, the EasyPACK™ HD3 makes large-scale production straightforward, while supporting flexible customization for your project needs.

Package

The EasyPACK™ HD3 pushes the boundaries of the Easy family, featuring a thermally optimized baseplate that enables around 15% improved Rthjh , translating to best-in-class output power and increased reliability - even under extreme stress modes (such as LVRT in PV or triple overload in ESS). With housing constructed from high-CTI 600 materials for 2000 V+ DC bus voltages and advanced gel for superior insulation, EasyPACK™ HD3 stands up to the most demanding operational environments. Available in both 12 mm and 15 mm design heights, its flexible pin grid supports high-current solder or PressFIT pins to enable double the current rating and lower PCB temperatures, while retaining compatibility with the Easy 3B pin grid.

Technologies

EasyPACK™ HD3 is featuring the latest Infineon technologies, including state-of-the-art CoolSiC™ MOSFETs, the newest TRENCHSTOP™ IGBT7 & IGBT8, and high-performance diodes. All are a perfect fit for industry-leading efficiency and reliability, supporting single-module solutions up to 400 kW, and power architectures such as 3-level NPC1 and 3-level boost. The platform is tailored for utility-scale solar inverters (300 kW+), advanced energy storage, and UPS AI Datacenter applications, empowering designers to achieve groundbreaking system performance, lower system losses, and maximize component lifespan.

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Design resources

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