S25HS02GTDPBHV153
Active and preferred
RoHS Compliant
Lead-free

S25HS02GTDPBHV153

Datasheet
package
ea.
in stock

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S25HS02GTDPBHV153
S25HS02GTDPBHV153
ea.
Datasheet

Product details

  • Density
    2 GBit
  • Family
    HS-T
  • Interface Bandwidth
    66 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    133 / 66
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 105 °C
  • Operating Voltage range
    1.7 V to 2 V
  • Operating Voltage
    1.8 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Industrial
Recommended
OPN
S25HS02GTDPBHV153
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-24801)
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-24801)
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The S25HS02GTDPBHV153 is a 2.0 Gbit HS-T Quad SPI NOR flash in a 24-ball BGA MCP (2 × 1 Gbit die) using 45-nm MIRRORBIT technology. It operates from 1.7 V to 2.0 V over -40°C to 105°C (industrial). Quad SPI supports 133 MHz SDR and 66 MHz DDR operation with up to 66 MByte/s bandwidth. Data integrity CRC, SECDED ECC, Endurance flex, and SafeBoot support reliable code and data storage.

Features

  • 45-nm MIRRORBIT™ 2 bits per cell
  • Multi-chip package: 2 × 1 Gb dies
  • Uniform or hybrid sector architecture
  • 256 or 512-byte program buffer
  • 1024-byte OTP secure silicon (SSR)
  • Quad SPI: 1-1-4, 1-4-4, 4-4-4
  • Quad SPI DDR read up to 102 MBps
  • ECC on 16-byte units, Hamming code
  • Corrects 1-bit, detects 2-bit errors
  • ECC status, trap address, counter
  • Endurance flex wear leveling regions
  • LBP + ASP sector/block protection

Benefits

  • Higher density lowers PCB footprint
  • Higher capacity in one BOM item
  • Aligns small params + bulk storage
  • Faster program cuts update time
  • Protect keys/IDs from cloning
  • Flexible host interface compatibility
  • Faster boot and code execute in place
  • ECC boosts read data reliability
  • Detects corruption before failure
  • Speeds debug and field diagnostics
  • Wear leveling extends flash lifetime
  • Prevents accidental erase or writes

Applications

Documents

Design resources

Partner solutions

Developer community

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