NEW
Active and preferred
RoHS Compliant

IAUCN10S7L040

NEW
100V, N-Ch, 3.95 mΩ max, Automotive MOSFET, SSO8 (5x6), OptiMOS™ 7
ea.
in stock

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IAUCN10S7L040
IAUCN10S7L040
ea.

Product details

  • ID (@25°C) max
    120 A
  • Launch year
    2025
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    PG-TDSON-8
  • Planned to be available until at least
    2038
  • Polarity
    N
  • QG (typ @10V)
    50.6 nC
  • Qualification
    Automotive
  • RDS (on) (@10V) max
    3.95 mΩ
  • Technology
    OptiMOS™-7
  • VDS max
    100 V
  • VGS(th)
    1.6 V
OPN
IAUCN10S7L040ATMA1
Product Status active and preferred
Infineon Package
Package Name Single SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name Single SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
IAUCN10S7L040 is an automotive MOSFET built with Infineon’s leading edge, power semiconductor technology; OptiMOS™ 7 100V.  This product is offered in our versatile, robust, high current SSO8 5x6mm² SMD package.  It is designed specifically for high performance, high quality and the robustness needed for demanding automotive applications. 

Features

  • Low on-resistance, RDS(on)
  • Leading edge FOM (RDS (on) x Qg)
  • Fast switching times (turn on/off)
  • High avalanche current capability
  • High SOA ruggedness
  • Tight threshold voltage, VGS(th), range
  • Excellent thermal performance
  • Low package resistance and inductance
  • Unique fused source pins
  • Extended qualification beyond AEC-Q101
  • Enhanced electrical testing
  • MSL1 up to 260°C peak reflow

Benefits

  • Very low conduction losses
  • Superior switching performance
  • Highest power density in 5x6mm package
  • High power efficiency
  • Small footprint & efficient cooling
  • Well suited for parallel placement
  • Increased design ruggedness
  • Better solder joint reliability
  • Designed for Automotive robustness
  • High quality production for Automotive

Documents

Design resources

Developer community

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