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Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
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Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Infineon to start limited Share Buyback Program serving fulfillment of obligations under existing employee participation programs
Q3 FY 2026 concluded with record sales driven by strong AI business; further significant increase in revenue and margin expected in Q4 FY 2026
Infineon and LS ELECTRIC collaborate to advance high-efficiency direct current power solutions for AI data centers
Business & Financial Press
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Quarterly Report
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×
Active and preferred
RoHS Compliant
FF900R12ME7W_B11
1200 V, 900 A half-bridge IGBT module
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FF900R12ME7W_B11
Product details
-
Configurationhalf-bridge
-
Dimensions (width)62 mm
-
Dimensions (length)152 mm
-
FeaturesWave structure on the base plate, PressFIT
-
HousingEconoDUAL™ 3
-
IC(nom) / IF(nom)900 A
-
IC max900 A
-
QualificationIndustrial
-
TechnologyIGBT7 - E7
-
VCE(sat) (Tvj=25°C typ)1.5 V
-
VCES / VRRM1200 V
-
VF (Tvj=25°C typ)1.8 V
-
Voltage Class max1200 V
| Recommended | ||
|
OPN
|
FF900R12ME7WB11BPSA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-ECONOD | |
| Package Name | N/A | |
| Packing Size | 6 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | No | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
| Country of Assembly (CoA) |
HU
|
|
| Country of Diffusion (CoD) |
AT,MY
|
|
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-ECONOD |
| Package Name | - |
| Packing Size | 6 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
HU
|
| Country of Diffusion (CoD) |
AT,MY
|
EconoDUAL™ 3 1200 V, 900 A half-bridge TRENCHSTOP™ IGBT7 module with emitter controlled 7 diode, NTC, PressFIT contact technology and wave structure on the base plate.
Features
- Wave structure on the baseplate
- Highest power density
- Best-in-class VCEsat
- Tvj op = 175°C overload
- Improved terminals
- PressFIT control pins
- Screw power terminals
- Integrated NTC temperature sensor
- Isolated base plate
- Compact and robust design
- Molded terminals
Applications
Documents
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