CYPT1069G30-10FZMB
Active and preferred
RoHS Compliant

CYPT1069G30-10FZMB

Infineon's 16Mb FAST Asynchronous SRAM with ECC for Radiation-Hardened Memory Solutions
Datasheet
package

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CYPT1069G30-10FZMB
CYPT1069G30-10FZMB
Datasheet


Product details

  • Density
    16 MBit
  • Device weight
    3878.7 mg
  • Family
    FAST SRAM
  • Interfaces
    Parallel
  • Operating Temperature range
    -55 °C to 125 °C
  • Operating Voltage range
    2.2 V to 3.6 V
  • Organization (X x Y)
    2Mb x 8
  • Package
    FLATPACK-36 (001-67583)
  • Planned to be available until at least
    2033
  • Qualification
    Military

Recommended
OPN
Product Status active and preferred
Infineon Package
CG-FP-36
Package Name FLATPACK-36 (001-67583)
Packing Size 1
Packing Type CONTAINER
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
US
Country of Diffusion (CoD)
TW

Product Status
Active
Infineon Package
CG-FP-36
Package Name FLATPACK-36 (001-67583)
Packing Size 1
Packing Type CONTAINER
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
US
Country of Diffusion (CoD)
TW
Infineon’s FAST 16 Mb asynchronous SRAM family, designed with Infineon’s patented RADSTOP™ technology is ideal for space as well as other harsh environment applications. The 16 Mb Fast SRAM is a high-performance, low power SRAM with ECC organized as 2-Mbit by 8-bits. Our RADSTOP™ memory solutions enhance overall system computing limits while providing Size, Weight, and Power (SWaP) benefits and greater design flexibility.

Features

  • 16 Mb density, 2M x 8
  • Embedded ECC for single-bit error correction
  • 10 ns access times
  • 2.2 V to 3.6 V operating voltage range
  • –55°C to +125°C military temperature grade
  • 36-pin ceramic flat pack (CFP)
  • DLAM QML-V qualified
  • TID: 200 Krad
  • SEL: > 60 MeV.cm2/mg @ 95°C
  • SEU: ≤ 1 x 10-10 upsets/bit-day
  • PROTOTYPE
  • Flight devices, order CYRS1069G30-10FZMB

Benefits

  • Designed with RADSTOP™ technology
  • Meet the reliability demands of extreme environments
  • Meet the lifecycle demands of extreme environments
  • Enhance overall system computing limits
  • Provides Size, Weight, and Power (SWaP) benefits
  • Greater design flexibility

Applications

Documents

Design resources

Partner solutions

Developer community