CY7C25652KV18-550BZXC
Active and preferred
RoHS Compliant

CY7C25652KV18-550BZXC

package

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CY7C25652KV18-550BZXC
CY7C25652KV18-550BZXC

Product details

  • Density
    72 MBit
  • Family
    QDR-II+, ODT
  • Frequency
    550 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    0 °C to 70 °C
  • Operating Voltage range
    1.7 V to 1.9 V
  • Organization (X x Y)
    2Mb x 36
  • Peak Reflow Temp
    260 °C
  • Qualification
    Commercial
Recommended
OPN
CY7C25652KV18-550BZXC
Product Status active and preferred
Infineon Package
PG-BGA-165
Package Name FBGA-165 (51-85180)
Packing Size 1360
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-165
Package Name FBGA-165 (51-85180)
Packing Size 1360
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
CY7C25652KV18-550BZXC is a 72-Mbit QDR II+ synchronous pipelined SRAM (2M × 36) with separate read and write DDR ports to support concurrent transactions. It runs up to 550 MHz (1100 MHz data rate) with 2.5-cycle read latency, using 1.8 V core (1.7 V to 1.9 V) and 1.4 V to VDD I/O supplies. On-die termination, echo clocks, QVLD, and an on-chip PLL aid high-speed timing in a 165-ball Pb-free FBGA.

Features

  • 550 MHz clock (1100 MHz DDR data)
  • Separate read and write data ports
  • Concurrent read/write transactions
  • Four-word burst architecture
  • 2.5-cycle read latency (DOFF HIGH)
  • 1-cycle read latency mode (DOFF LOW)
  • Two input clocks (K and K)
  • Echo clocks CQ/CQ for data capture
  • QVLD pin indicates valid read data
  • On-die termination for D/BWS/K
  • PLL runs down to 120 MHz
  • Core VDD 1.7 V to 1.9 V

Benefits

  • High bandwidth for fast DSP/ASIC
  • No bus turn-around delays
  • Read and write run in parallel
  • Lower address bus frequency
  • Deterministic 2.5-cycle reads
  • 1-cycle reads for low latency
  • Simpler DDR timing with K/K
  • Easier high-speed data capture
  • QVLD reduces timing margin effort
  • ODT cuts external termination BOM
  • PLL improves data placement margin
  • 1.8 V core reduces power vs 2.5 V

Applications

Documents

Design resources

Partner solutions

Developer community

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