CY62126EV30LL-45ZSXIT
Active and preferred
RoHS Compliant
Lead-free

CY62126EV30LL-45ZSXIT

ea.
in stock

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

CY62126EV30LL-45ZSXIT
CY62126EV30LL-45ZSXIT
ea.

Product details

  • Density
    1 MBit
  • Family
    MoBL™ SRAM
  • Interfaces
    Parallel
  • Lead Ball Finish
    Ni/Pd/Au
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage (VCCQ) max
    3.6 V
  • Operating Voltage range
    2.2 V to 3.6 V
  • Organization (X x Y)
    64K x 16
  • Peak Reflow Temp
    260 °C
  • Qualification
    Industrial
  • Speed
    45 ns
OPN
CY62126EV30LL-45ZSXIT
Product Status active and preferred
Infineon Package
Package Name TSOP-II-44 (51-85087)
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name TSOP-II-44 (51-85087)
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
CY62126EV30LL-45ZSXIT is a 1-Mbit (64 K × 16) CMOS SRAM for battery-powered designs. It operates from 2.2 V to 3.6 V and supports 45 ns access. Automatic CE power-down reduces standby current to 4 µA max (1 µA typ) and cuts power when addresses stop toggling. Active current is 2.0 mA max at 1 MHz. It is offered in a Pb-free 44-pin TSOP II package for -40°C to +85°C industrial range.

Features

  • 1-Mbit SRAM organized as 64K × 16
  • 45 ns read/write cycle time
  • 2.2 V to 3.6 V single-supply VCC
  • 1.3 mA typ active at 1 MHz
  • 4 µA max standby current
  • Auto power-down when addr static
  • Data retention at VCC down to 1.5 V
  • 3 µA max data-retention current
  • Byte write via BLE/BHE controls
  • Tri-state I/O via CE/OE/BHE/BLE

Benefits

  • 16-bit bus cuts MCU accesses
  • 45 ns suits fast SRAM interfaces
  • 2.2–3.6 V fits 3 V systems
  • Low active current extends runtime
  • µA standby minimizes sleep drain
  • Auto power-down saves idle power
  • 1.5 V retain data in deep sleep
  • Low ICCDR reduces backup load
  • Byte writes reduce write energy
  • Tri-state eases bus sharing/expand

Applications

Documents

Design resources

Developer community