QFN-24 (51-85203)

PG-VQFN-24-803

Package details

  • Package Material
    PG
  • Package Family
    PG-VQFN
  • Terminals
    24
  • Variant
    803
  • Exposed Paddle
    Yes
  • Body Length (mm)
    4.0
  • Body Width (mm)
    4.0
  • Min. Terminal Pitch (mm)
    0.5
Infineon quad flat nonleaded (QFN) packages are offered as various families. Alternative and legacy designations may be micro-leadframe package quad (MLPQ). The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Typical products are gate driver ICs, oscillators, gate drivers, voltage regulators, microcontrollers, audio amplifier ICs, motor driver ICs, wireless charging ICs, and more.

Image Gallery

PG-VQFN-24-803_Package Outline
PG-VQFN-24-803_Package Outline
PG-VQFN-24-803_Package Outline PG-VQFN-24-803_Package Outline PG-VQFN-24-803_Package Outline
PG-VQFN-24-803_Bakeable Trays PG-VQFN-24-803_Bakeable Trays PG-VQFN-24-803_Bakeable Trays
PG-VQFN-24-803_Footprint Drawing PG-VQFN-24-803_Footprint Drawing PG-VQFN-24-803_Footprint Drawing
PG-VQFN-24-803_Tape and Reel PG-VQFN-24-803_Tape and Reel PG-VQFN-24-803_Tape and Reel

Documents and drawings