TEQFP-144 (002-28240)

PG-TQFP-144-804

Package details

  • Package Material
    PG
  • Package Family
    PG-TQFP
  • Terminals
    144
  • Variant
    804
  • Exposed Paddle
    Yes
  • Body Length (mm)
    20.0
  • Body Width (mm)
    20.0
  • Min. Terminal Pitch (mm)
    0.5
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    550
    1
  • TRAY
    Pieces/Reel
    Reels/Box
     
    600
    10
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    300
    1
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-TQFP-144-804_Bakeable Trays
PG-TQFP-144-804_Bakeable Trays
PG-TQFP-144-804_Bakeable Trays PG-TQFP-144-804_Bakeable Trays PG-TQFP-144-804_Bakeable Trays
PG-TQFP-144-804_Footprint Drawing PG-TQFP-144-804_Footprint Drawing PG-TQFP-144-804_Footprint Drawing
PG-TQFP-144-804_Package Outline PG-TQFP-144-804_Package Outline PG-TQFP-144-804_Package Outline
PG-TQFP-144-804_Tape and Reel PG-TQFP-144-804_Tape and Reel PG-TQFP-144-804_Tape and Reel

Documents and drawings