PG-TQFP-100-23

Package details

  • Package Material
    PG
  • Package Family
    PG-TQFP
  • Terminals
    100
  • Variant
    23
  • Exposed Paddle
    Yes
  • Body Length (mm)
    12.0
  • Body Width (mm)
    12.0
  • Min. Terminal Pitch (mm)
    0.4
  • TRAY
    Pieces/Reel
    Reels/Box
     
    714
    6
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1000
    1
    330
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-TQFP-100-23-TP
PG-TQFP-100-23-TP
PG-TQFP-100-23-TP PG-TQFP-100-23-TP PG-TQFP-100-23-TP
PG-TQFP-100-23_Footprint Drawing PG-TQFP-100-23_Footprint Drawing PG-TQFP-100-23_Footprint Drawing
PG-TQFP-100-23_Tape and Reel_01 PG-TQFP-100-23_Tape and Reel_01 PG-TQFP-100-23_Tape and Reel_01
PG-TQFP-100-23_Package Outline PG-TQFP-100-23_Package Outline PG-TQFP-100-23_Package Outline
PG-TQFP-100-23_Bakeable Trays PG-TQFP-100-23_Bakeable Trays PG-TQFP-100-23_Bakeable Trays

Documents and drawings