PG-TLGA-4-2

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Package details

  • Package Material
    PG
  • Package Family
    PG-TLGA
  • Terminals
    4
  • Variant
    2
  • Exposed Paddle
    No
  • Body Length (mm)
    3.35
  • Body Width (mm)
    2.5
  • Min. Terminal Pitch (mm)
    0.775
Infineon land grid array packages (LGA) for sensors are offered as various families. They are available as low profile (L), thin (T), very thin (V), and very very thin (W) versions. The package body may feature plastic overmold or metal lid. The micro electro-mechanical system (MEMS) for pressure or sound measurement may be exposed through an open signal port on the top or bottom of the body. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). In case the signal port is located in the landing area of the package special attention must be given to the vicinity of the solder joint. Typical products are MEMS microphones, pressures sensors, switches, and more.

Image Gallery

PG-TLGA-4-2_Footprint Drawing
PG-TLGA-4-2_Footprint Drawing
PG-TLGA-4-2_Footprint Drawing PG-TLGA-4-2_Footprint Drawing PG-TLGA-4-2_Footprint Drawing
PG-TLGA-4-2_Tape and Reel_01 PG-TLGA-4-2_Tape and Reel_01 PG-TLGA-4-2_Tape and Reel_01
PG-TLGA-4-2_Package Outline PG-TLGA-4-2_Package Outline PG-TLGA-4-2_Package Outline
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Documents and drawings

Documents and drawings