PG-LQFP-176-6

Package details

  • Package Material
    PG
  • Package Family
    PG-LQFP
  • Terminals
    176
  • Variant
    6
  • Exposed Paddle
    Yes
  • Body Length (mm)
    24.0
  • Body Width (mm)
    24.0
  • Min. Terminal Pitch (mm)
    0.5
  • TRAY
    Pieces/Reel
    Reels/Box
     
    240
    6
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    500
    1
    330
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-LQFP-176-6_Footprint Drawing
PG-LQFP-176-6_Footprint Drawing
PG-LQFP-176-6_Footprint Drawing PG-LQFP-176-6_Footprint Drawing PG-LQFP-176-6_Footprint Drawing
PG-LQFP-176-6,-12,-20-TP PG-LQFP-176-6,-12,-20-TP PG-LQFP-176-6,-12,-20-TP
PG-LQFP-176-6_Tape and Reel_01 PG-LQFP-176-6_Tape and Reel_01 PG-LQFP-176-6_Tape and Reel_01
PG-LQFP-176-6,-12,-20-BKT PG-LQFP-176-6,-12,-20-BKT PG-LQFP-176-6,-12,-20-BKT
PG-LQFP-176-6_Package Outline PG-LQFP-176-6_Package Outline PG-LQFP-176-6_Package Outline

Documents and drawings