mTOLG

PG-HSOG-4-1

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Package details

  • Package Material
    PG
  • Package Family
    PG-HSOG
  • Terminals
    4
  • Variant
    1
  • Exposed Paddle
    Yes
  • Body Length (mm)
    8.0
  • Body Width (mm)
    6.2
  • Min. Terminal Pitch (mm)
    2.0
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    2000
    1
    330
Infineon heatsink small outline gullwing (HSOG) packages are offered as different families. They are also available as low profile (L) version. Alternative designation examples are TO-leaded with gullwing (TOLG) for HSOG-8 and mTOLG for LHSOG-8. The HSOG packages present a space optimized version of the TO263 (D2PAK). The tab thickness is reduced to decrease the junction to case thermal resistance while the height shrink increases the power density. The gullwing shaped leads allow for high-throughput board mounting using surface mount technology (SMT). The single-side leads request for precise mouting setup in order to take the component at the mold body center during pick&place. Typical products are automotive MOSFET.

Image Gallery

PG-HSOG-4-1_Footprint Drawing
PG-HSOG-4-1_Footprint Drawing
PG-HSOG-4-1_Footprint Drawing PG-HSOG-4-1_Footprint Drawing PG-HSOG-4-1_Footprint Drawing
PG-HSOG-4-1_Package Outline PG-HSOG-4-1_Package Outline PG-HSOG-4-1_Package Outline
PG-HSOG-4-1_Tape and Reel PG-HSOG-4-1_Tape and Reel PG-HSOG-4-1_Tape and Reel
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Documents and drawings

Documents and drawings